Modelling and Thermal Analysis of Advanced Insulating Layer of Electronic Applications

Abstract

This paper proposes the replacement of a conventional Insulating-Metal-Substrate (IMS) dielectric layer with an electroconductive adhesive which is applied onto a treated aluminium heat sink. The adhesive based structure results in a lower thermal resistance of the system compared to IMS based on Aluminium. The model covers the investigation of two IMS structure with a Copper conductor layer with a thickness of 200µm, a dielectric layer of 50µm with different thermal conductivities and an Aluminium base layer with a thickness of 920µm. However, the IMS is placed onto a 100 x 100 x 33 mm Aluminium heat sink. The investigated adhesive based structure consists of the same Aluminium heat sink treated with an oxidation layer with a thickness of 50µm and an adhesive conductor layer with 30µm thickness. Furthermore, the use of forced convection to reduce the junction temperature of all three models is also considered.

Thermal Characterisation of Insulating Layers in Metal Core PCB

“…For example, the embedded heat pipe solutions have been proposed to decrease the junction temperature of semiconductors in high power applications [15], [16]. The thermal performance of advanced insulating layers for aluminium based MCPCB has been numerically evaluated in [17]. The experimental performance of advanced insulating layers in aluminium based MCPCBs for high power applications was demonstrated and analysed in [18].…”