2020
DOI: 10.1016/j.jsv.2020.115246
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Modelling approach for MEMS transducers with rectangular clamped plate loaded by a thin fluid layer

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Cited by 5 publications
(15 citation statements)
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“…Due to the symmetry of the transducer’s geometry, the solution of ( 14 ) for nonuniform is expressed here in the first quadrant only (namely, ). The chosen Green’s function used in the integral formulation for the solution of ( 14 ) satisfies the same Neumann’s condition (the first derivative vanishes) at as the solution for the acoustic pressure, which can be expressed as follows [ 26 , 27 , 29 ]: with the Green’s function being given by with where denotes the cylindrical Hankel function of the second kind of order “0”.…”
Section: Analytical Solutionmentioning
confidence: 99%
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“…Due to the symmetry of the transducer’s geometry, the solution of ( 14 ) for nonuniform is expressed here in the first quadrant only (namely, ). The chosen Green’s function used in the integral formulation for the solution of ( 14 ) satisfies the same Neumann’s condition (the first derivative vanishes) at as the solution for the acoustic pressure, which can be expressed as follows [ 26 , 27 , 29 ]: with the Green’s function being given by with where denotes the cylindrical Hankel function of the second kind of order “0”.…”
Section: Analytical Solutionmentioning
confidence: 99%
“…The displacement field can be searched for in the following form of series expansion (with some truncation in practical implementation): where the orthonormal eigenfunctions satisfy the homogeneous equation associated with Equation ( 30 ): where . An approximate form of such eigenfunctions can be obtained as a series expansion over known functions from numerically (FEM) calculated results using the method described in [ 31 ] for nonperforated rectangular clamped plates and in [ 32 ] for perforated square clamped plates, the latter being used herein (see Appendix A ).…”
Section: Analytical Solutionmentioning
confidence: 99%
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“…13 A two-dimensional transducer covering a rectangular or square shaped plate loaded using a fluid gap enclosed by peripheral cavity was designed. 14 A MEMS-based piezoelectric thin film based acoustic transducer was discussed. 15 A microphone was developed using silicon on insulator (SOI)-based wafer substrate.…”
Section: Introductionmentioning
confidence: 99%