Modelling dc characteristics of the IGBT module with thermal phenomena taken into account

Górecki, Paweł; Górecki, Krzysztof

doi:10.1109/cpe.2019.8862319

Cited by 5 publications

(5 citation statements)

References 24 publications

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“…As it is commonly known, junction temperature strongly influences the properties of semiconductor devices, for example, power LEDs [3,4,6,[19][20][21][22][23][24] and electronic networks [25,26]. The value of this temperature is higher than the ambient temperature due to self-heating phenomena and mutual thermal couplings between devices situated on the common PCB or a heat-sink.…”

Section: Introductionmentioning

confidence: 99%

Thermal, Photometric and Radiometric Properties of Multi-Color LEDs Situated on the Common PCB

Górecki

Ptak

2020

Electronics

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This paper presents the results of experimental investigations illustrating the influence of the spectra of the light emitted by power LEDs on their thermal, photometric and radiometric parameters. The investigations were performed for six diodes emitting white or monochromatic light of different spectra. Each of these diodes was produced by the same manufacturer, mounted in the same package and the tested devices were soldered to the common PCB. In the paper, the manner and set-ups making possible measurements of self and transfer transient thermal impedances, illuminance and the surface power density of the light emitted by the tested devices are described. Selected results of measurements are shown and discussed. These results prove that the spectra of the emitted light influence self-transient thermal impedances of the considered devices and transfer transient thermal impedances between some pairs of these devices. Additionally, it is proved that thermal couplings between the tested diodes strongly influence their junction temperature and the surface power density of the emitted radiation.

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Section: Introductionmentioning

confidence: 99%

Thermal, Photometric and Radiometric Properties of Multi-Color LEDs Situated on the Common PCB

Górecki

Ptak

2020

Electronics

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“…For all the considered cooling and operating conditions of this module, the results of computations fit well the results of the measurements. Due to the dependence of thermal resistances on the power, a much better accuracy in modeling the characteristics of the module components was achieved than with the model described in [34].…”

Section: Discussionmentioning

confidence: 99%

“…In order to compute non-isothermal characteristics of the considered DC-DC converter at the steady-state, the method of the electrothermal transient analysis with one nonphysical thermal time constant [34] is applied. In the analyses, the electrothermal model of the IGBT module described in the previous section and the electrothermal model of diodes D 3 and D 4 are used passive elements are modeled with the use of the linear models built-in in SPICE [38].…”

Section: Characteristics Of the Half-bridge Converter With An Igbt Mo...mentioning

confidence: 99%

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SPICE-Aided Nonlinear Electrothermal Modeling of an IGBT Module

Górecki,

Górecki

2023

Electronics

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The paper proposes a compact electrothermal model of the IGBT module in the form of a subcircuit for SPICE. This model simultaneously takes into account electrical phenomena occurring in the module components and thermal phenomena occurring in this module. In the description of electrical phenomena, the previously formulated models of the IGBT and the diode are used, whereas the description of thermal phenomena is original. While describing thermal phenomena, self-heating in each component, mutual thermal couplings between each pair of these components, and the influence of the dissipated power on the efficiency of heat removal are taken into account. The form of the proposed model and the results of its experimental verification for the IGBT module operating under different cooling conditions are presented. The DC characteristics of the module and the characteristics of the half-bridge converter containing the considered module are presented.

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“…Power LEDs are today the most important components of solid-state lighting sources [1][2][3]. Temperature strongly influences properties of all semiconductor devices, including power LEDs, [1,2,[4][5][6]. For a single semiconductor device, the value of its junction temperature depends on both the ambient temperature T a and the excess ∆T of the device internal junction temperature, which is caused by the self-heating phenomenon [7][8][9][10][11][12][13].…”

Section: Introductionmentioning

confidence: 99%

Influence of a Thermal Pad on Selected Parameters of Power LEDs

et al. 2020

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This paper is devoted to the analysis of the influence of thermal pads on electric, optical, and thermal parameters of power LEDs. Measurements of parameters, such as thermal resistance, optical efficiency, and optical power, were performed for selected types of power LEDs operating with a thermal pad and without it at different values of the diode forward current and temperature of the cold plate. First, the measurement set-up used in the paper is described in detail. Then, the measurement results obtained for both considered manners of power LED assembly are compared. Some characteristics that illustrate the influence of forward current and temperature of the cold plate on electric, thermal, and optical properties of the tested devices are presented and discussed. It is shown that the use of the thermal pad makes it possible to achieve more advantageous values of operating parameters of the considered semiconductor devices at lower values of their junction temperature, which guarantees an increase in their lifetime.

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Modelling dc characteristics of the IGBT module with thermal phenomena taken into account

Cited by 5 publications

References 24 publications

Thermal, Photometric and Radiometric Properties of Multi-Color LEDs Situated on the Common PCB

Thermal, Photometric and Radiometric Properties of Multi-Color LEDs Situated on the Common PCB

SPICE-Aided Nonlinear Electrothermal Modeling of an IGBT Module

Influence of a Thermal Pad on Selected Parameters of Power LEDs

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