Modelling methodology for thermal analysis of hot solder dip process

Study of impact of thermal refinishing process on reliability of COTS components

“…For the purpose of validation of the HSD thermal models developed for this process and their predictive capability, this study case is used to derive model predicted temperature data at all five locations. The model data is given in figure 5 There is very good agreement not just in terms of TC and model data at the centre of the IC die which was previ reported in reference [7] but also at the new monitored locations. Peak temperatures obtained from models are marginally higher, in the range 170…”

“…As experience with HSD has advanced there emerges a view that the extensive part qualification and the recommended qualification environments recommended may be overly onerous and indeed possibly damaging to some component types. Modelling approaches may contribute to better physical understanding of potential damage mechanisms and aid safer engineering judgements while reducing risk and cost [7,8].…”

“…The modelling approach using finite elements is eference [7] and hence is Figure 3 figure 3, is obtained. The TC data from all five channels is given in Figure 4.…”

Similarity approach for reducing qualification tests of electronic components

“…In this study, the potential of using similarity-based approach with SOM to qualification and reliability assessments of electronic parts is demonstrated in the case of hot solder dip refinishing process [16][17][18]. This post-manufacturing process is adopted at present by many electronics manufacturers of equipment used in high reliability applications as a tin-whisker risk mitigation strategy [19].…”

Thermomechanical Analysis of Conformally Coated QFNs for High-Reliability Applications

“…[5][6]. Another benefit from the use of conformal coating is it can reduce the risk of tin-whiskers on pure tin surface finishes [7][8][9][10]. Although the thermal cycling reliability of QFNs has been previously studied [1][2][3], there is a lack of understanding about the impact of using conformal coating on the reliability of these components [4].…”