2007
DOI: 10.1016/j.jcrysgro.2006.11.151
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Modelling of group-III nitride MOVPE in the closed coupled showerhead reactor and Planetary Reactor®

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Cited by 17 publications
(14 citation statements)
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“…Gas injection flow speed in this type of reactor is extremely high for a large high-flow-speed reactor. As a result of the high flow speed, organometallics cannot reach the wafer surface within a reasonable distance from the gas injection nozzle without the suppression effect of the additional top flow of three-layer gas injection [17]. For high-growth-rate GaN, we have developed a production-scale multiwafer reactor (Taiyo Nippon Sanso Corp., SR23K) [18].…”
Section: Concentration (Mol/l)mentioning
confidence: 99%
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“…Gas injection flow speed in this type of reactor is extremely high for a large high-flow-speed reactor. As a result of the high flow speed, organometallics cannot reach the wafer surface within a reasonable distance from the gas injection nozzle without the suppression effect of the additional top flow of three-layer gas injection [17]. For high-growth-rate GaN, we have developed a production-scale multiwafer reactor (Taiyo Nippon Sanso Corp., SR23K) [18].…”
Section: Concentration (Mol/l)mentioning
confidence: 99%
“…The reactor geometry is similar to the planetary reactor in Ref. [17]. We have employed a specifically designed three-flow gas injection with a flow speed of more than 1 m/s at the wafer center.…”
Section: Concentration (Mol/l)mentioning
confidence: 99%
“…The spatial luminescence wavelength uniformity is determined among others by the spatial uniformity of the In mole fraction in the quantum wells (QW)s. Spatial non-uniformities of the In mole fractions in the InGaN QWs can occur due to a variation of the In supply or the In incorporation into InGaN. On the supply side optimized flow conditions [7,8] and nitrogen as carriers gas [9] are commonly used to achieve a homogeneous composition over the wafer by the interplay of precursor depletion in the gas phase and averaging by wafer rotation in a planetary reactor [10]. The incorporation of In into InGaN on the other hand strongly depends on the temperature on the wafer surface [11].…”
Section: Introductionmentioning
confidence: 99%
“…By changing the total flow and the mixture of the gases for each inlet, the transport by flow and also the diffusion can be influenced [4]. Due to a radial depletion of the group III precursors across the substrate, a depletion profile is developed with a characteristic maximum peak and an almost linear decline for the growth rate [5]. By changing the total flow, the position of the peak can be moved, also influencing the position and shape of the linear region.…”
Section: Introductionmentioning
confidence: 99%
“…By changing the total flow, the position of the peak can be moved, also influencing the position and shape of the linear region. A rotation of the substrate in the linear region results in homogeneous film deposition [5]. Diffusion of metal-organic precursor can be controlled by changing the gas species to a one with higher or lower molecular weight and therefore the slope and shape of the lin-ear region of the depletion profile can be influenced.…”
Section: Introductionmentioning
confidence: 99%