“…Welding speed, wire feed rate, arc voltage [96] Microstructure, mechanical properties Pre-heating of substrate, scanning speed, idle time [93] Residual stresses Melt pool geometry, metal powder flow rate, laser power, scanning speed, scanning direction, and deposition layer thickness [97] Microstructure, hardness, residual stresses Deposition parameters [94] Residual stress history, microstructure Phase change [98] Total spread of droplet, solidification front speed, interlamellar spacing Droplet size, speed, superheat [99] Microstructure, hardness Substrate size, idle time [100] Powder-to-solid transition Temperature, porosity-dependent conduction [101] Grain size, grain growth speed, Temperature, deposition over time [115] Thermal history Laser-scan velocities [102] Spreading and shape of the droplet after impact Substrate roughness and temperature, speed of droplet [103] Splashing of droplets Impact velocity, temperature [104] Fingering and splashing of the droplet Droplet velocity, liquid type, temperature of surface, surface roughness, contact angle [105] Desired shape after impact Initial droplet shape [106] Microstructure, temperature field Number of layers, layer height, wire feed rate, travel speed, heat input optimizing the process mechanics can lead to the improvement of such issues. In Table 8, the modelled KPIs and the process parameters used in each study can be seen.…”