Modelling of thermal effect in through-silicon via for 3D IC

Krishna, R. Radeep; Sivakumar, P.; Abraham, Nancy; Abraham, C. G.; Sreedivya, K. M.

doi:10.1049/icp.2023.1420

IET Conf. Proc.

2023

DOI: 10.1049/icp.2023.1420

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Modelling of thermal effect in through-silicon via for 3D IC

R. Radeep Krishna

P. Sivakumar

Nancy Abraham

et al.

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Modelling of thermal effect in through-silicon via for 3D IC

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