Modelling of Transmission Lines Inside Modern Integrated Semiconductor and Test Boards

Zubert, Mariusz; Jankowski, Mariusz; Kulesza, Zbigniew; Napieralski, A.

doi:10.1109/access.2021.3086852

Cited by 2 publications

(1 citation statement)

References 37 publications

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“…The effective modelling and simulation methods of electromagnetic (EM) and thermal phenomena of integration circuits, micro-electro-mechanical systems (MEMSs), and 3D integrated systems (see [1,5]).…”

Section: Introductionmentioning

confidence: 99%

Application of Scattering Parameters to DPL Time-Lag Parameter Estimation at Nanoscale in Modern Integration Circuit Structures

et al. 2021

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This paper presents the methodology of material parameters’ estimation for the dual-phase-lag (DPL) model at the nanoscale in modern integration circuit (IC) structures. The analyses and measurements performed were used in the unique dedicated micro-electro-mechanical system (MEMS) test structure. The electric and thermal domain of this structure was analysed. Finally, the silicon dioxide (SiO2) temperature time-lag estimation procedure is presented based on the scattering parameters measured by a vector network analyser for the considered MEMS structure together with the 2-omega method. The proposed methodology has the ability to estimate the time-lag parameter with high accuracy and is also suitable for the temperature time-lag estimation for other manufacturing process technologies of ICs and other insulation materials used for integrated circuits such as silicon nitride (Si3N4), titanium nitride (TiN), and hafnium dioxide (HfO2).

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Section: Introductionmentioning

confidence: 99%

Application of Scattering Parameters to DPL Time-Lag Parameter Estimation at Nanoscale in Modern Integration Circuit Structures

et al. 2021

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Towards the Construction of an Analog Solver for the Schrödinger and Ginzburg–Landau Equations Based on a Transmission Line

Pomorski,

Pluszyński,

Hałubek

2024

Condensed Matter

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The model presented by Gabriel Kron in 1945 is an example of an analog computer simulating quantum phenomena on a hardware level. It uses passive RLC elements to construct a hardware solver for the problem of quantum particles confined by rectangular or other classes of potential. The analytical and numerical validation of Kron’s second model is conducted for different shapes of particle-confining potentials in the one-dimensional case using an LTspice simulator. Thus, there remains potential for obtaining solutions in two- and three-dimensional cases. Here, a circuit model representing a linearized Ginzburg–Landau equation is given. Kron’s second model is generalized by the introduction of linear and non-linear resistive elements. This transforms the deformed Schrödinger equation into a linear dissipative Schrödinger equation and its non-linear form. The quantum mechanical roton problem is the main result of this work and is formulated by means of classical physical states naturally present in the LC classical circular electrical transmission line. The experimental verification of Kron’s model is confirmed.

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Modelling of Transmission Lines Inside Modern Integrated Semiconductor and Test Boards

Cited by 2 publications

References 37 publications

Application of Scattering Parameters to DPL Time-Lag Parameter Estimation at Nanoscale in Modern Integration Circuit Structures

Application of Scattering Parameters to DPL Time-Lag Parameter Estimation at Nanoscale in Modern Integration Circuit Structures

Towards the Construction of an Analog Solver for the Schrödinger and Ginzburg–Landau Equations Based on a Transmission Line

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