2021 12th International Symposium on Advanced Topics in Electrical Engineering (ATEE) 2021
DOI: 10.1109/atee52255.2021.9425281
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Modelling the Temperature Conditions of a Printed Circuit Board

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Cited by 7 publications
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“…At the same time, it is necessary at this stage to take into account the heating of components that are placed on the board for its further reliable operation, and it is advisable to conduct such thermal analysis in 3D modeling systems, for example, SolidWorks, Cadence, etc. [5][6][7][8] After completing the circuit input work, it checks for errors and compliance with the specified parameters, and if the test is successfully passed, a list of circuits is generated for transmission to the trace program. From this point on, any possibility of errors occurring at further design stages is eliminated.…”
Section: Design and Manufacture Of A Printed Circuit Board In Cadmentioning
confidence: 99%
“…At the same time, it is necessary at this stage to take into account the heating of components that are placed on the board for its further reliable operation, and it is advisable to conduct such thermal analysis in 3D modeling systems, for example, SolidWorks, Cadence, etc. [5][6][7][8] After completing the circuit input work, it checks for errors and compliance with the specified parameters, and if the test is successfully passed, a list of circuits is generated for transmission to the trace program. From this point on, any possibility of errors occurring at further design stages is eliminated.…”
Section: Design and Manufacture Of A Printed Circuit Board In Cadmentioning
confidence: 99%