Wet photoelectrochemical etching of GaAs was investigated with the use of a numerical model that calculated electron, hole, and potential distributions in a selectively illuminated semiconductor. The Galerkin finite element method was used to solve the Poisson equation for the potential and the species transport equations for holes, and electrons in two dimensions. The transport equations included generation, recombination, diffusion, and migration terms. A technique was developed for examining the sensitivity of the distribution of holes, electrons, and the potential to the parameters of the system including the surface reaction rate constant, diffusion coefficients, doping concentration, light intensity, wavelength, and the recombination length. The sensitivity analysis technique facilitated identification of parameters for which the behavior of this complex, nonlinearly coupled system is most sensitive.Anisotropic etching is essential for creating the closely spaced fine patterns needed for microelectronic devices. In the case of semiconductors, anisotropic etching of high-aspect trenches having vertical sidewalls may be accomplished by using a combination of wet etching in conjunction with selective illumination of the region to be etched. In such cases, interesting questions arise concerning the difference in etch rates between the illuminated and the dark regions of the surface, as well as the sharpness with which the boundary between the two regions may be achieved. In the present investigation, a numerical simulation 1 was carried out on the reaction and transport phenomena at the edge of the illuminated region during photoetching of n-GaAs in an electrolytic solution.When an n-type semiconductor is immersed in an electrolytic solution, the energy bands bend to establish equilibrium between the semiconductor and the solution. Band bending produces a potential gradient, or space-charge layer, near the surface. Illumination decreases band bending by producing a photovoltage 2 and a change in surface potential 3 which may be experimentally measured by electrolyte electroreflectance and photoreflectance techniques. 4 A result of surface illumination is a non-uniform potential distribution along the surface, the illuminated regions being less negative than the dark regions.Selective photoetching of semiconductors in an electrolytic solution may thus be accomplished by illuminating specific regions of the surface by light having an energy greater than the bandgap energy. Anisotropic maskless photoetching of GaAs, InP, InGaAs, and HgCdTe using a focused laser has been demonstrated in the fabrication of various grating profiles, grooves, trenches, and throughholes. ~-12In a semiconductor the distribution of etch rate is controlled by the distribution of potential and of carrier concentration. These distributions are affected by illumination wavelength and intensity, doping concentration, surface reaction processes, rate of recombination, surface potential, and diffusion coefficients. Several mathematical models h...