Modified Epoxy Resin Synthesis from Phosphorus—Containing Polyol and Physical Changes Studies in the Synthesized Products

Jang, Jeong Beom; Kim, Tae Hee; Kim, Taeyoon; Kim, Hye Jin; Seo, Bongkuk; Lim, Choong‐Sun; Lee, Wonjoo

doi:10.3390/polym11122116

Cited by 4 publications

(4 citation statements)

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“…P-polyol was synthesized using a previously reported method [ 22 ]. For a typical synthesis, trimethylamine (30 g), ethylene glycol (10 g), and methylene chloride (30 mL) were added to a 250 mL three-neck flask.…”

Section: Methodsmentioning

confidence: 99%

“…We previously synthesized an aromatic group-rich phosphorous-containing polyol (P-polyol) by reacting ethylene glycol with phenylphosphonic dichloride, followed by the addition of epoxy to prepare elastomeric polyurethane and determined that the storage modulus of elastomeric polyurethane was 39% higher than that of P-polyol. [ 22 ] In this study, we synthesized WPU with remarkable mechanical and thermal properties by reacting mixtures of different amounts of P-polyol and polycarbonate diol (PCD) with isophorone diisocyanate (IPDI) ( Figure 1 ). The mechanical properties of the obtained WPU films were measured using a universal testing machine (UTM) and dynamic mechanical analysis (DMA), and the thermal properties were tested using differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA).…”

Section: Introductionmentioning

confidence: 99%

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Synthesis of Waterborne Polyurethane Using Phosphorus-Modified Rigid Polyol and its Physical Properties

et al. 2021

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In this study, a phosphorous-containing polyol (P-polyol) was synthesized and reacted with isophorone diisocyanate (IPDI) to produce water-dispersed polyurethane. To synthesize waterborne polyurethanes (WPUs), mixtures of P-polyol and polycarbonate diol (PCD) were reacted with IPDI, followed by the addition of dimethylol propionic acid, to confer hydrophilicity to the produced polyurethane. An excess amount of water was used to disperse polyurethane in water, and the terminal isocyanate groups of the resulting WPUs were capped with ethylene diamine. P-polyol:PCD molar ratios of 0.1:0.9, 0.2:0.8, and 0.3:0.7 were used to synthesize WPUs. The films prepared by casting and drying the synthesized WPUs in plastic Petri dishes were used to test the changes in physical properties induced by changing the P-polyol:PCD molar ratio. The experimental results revealed that the tensile strength of PU-10, the WPU with a P-polyol:PCD molar ratio of 0.1:0.9, was 16% higher than that of the reference P-polyol–free WPU sample. Moreover, the thermal decomposition temperature of PU-10 was 27 °C higher than that of the reference sample.

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Section: Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Synthesis of Waterborne Polyurethane Using Phosphorus-Modified Rigid Polyol and its Physical Properties

et al. 2021

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“…Therefore, plasticizers, adhesion promoters, thinners or lubricants are added to transform the original raw material into a processable molding compound [16,17]. By mixing in the additives, EMCs can be modified and adapted to the respective application or requirement [18]. EMCs in the form of granules or pellets can be processed using transfer molding or injection molding [16,19].…”

Section: Basics Of Epoxy Molding Compoundsmentioning

confidence: 99%

Characterization of Hermetically Sealed Metallic Feedthroughs through Injection-Molded Epoxy-Molding Compounds

et al. 2021

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Electronic devices and their associated sensors are exposed to increasing mechanical, thermal and chemical stress in modern applications. In many areas of application, the electronics are completely encapsulated with thermosets in a single process step using injection molding technology, especially with epoxy molding compounds (EMC). The implementation of the connection of complete systems for electrical access through a thermoset encapsulation is of particular importance. In practice, metal pin contacts are used for this purpose, which are encapsulated together with the complete system in a single injection molding process step. However, this procedure contains challenges because the interface between the metallic pins and the plastic represents a weak point for reliability. In order to investigate the reliability of the interface, in this study, metallic pin contacts made of copper-nickel-tin alloy (CuNiSn) and bronze (CuSn6) are encapsulated with standard EMC materials. The metal surfaces made of CuNiSn are further coated with silver (Ag) and tin (Sn). An injection molding tool to produce test specimens is designed and manufactured according to the design rules of EMC processing. The reliability of the metal-plastic interfaces are investigated by means of shear and leak tests. The results of the investigations show that the reliability of the metal-plastic joints can be increased by using different material combinations.

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“…Epoxy resins are used in a broad variety of fields, such as electrical, electronics, and adhesive, as well as casting applications and construction because of their high adhesion, outstanding electrical and mechanical properties, and good alkali and moisture resistance [1][2][3]. However, the flammability and low transparency of epoxy resin composites are major disadvantages in their application, especially when used in circuit boards and coatings [4,5].…”

Section: Introductionmentioning

confidence: 99%

Flame-Retardant Performance of Transparent and Tensile-Strength-Enhanced Epoxy Resins

Cai

2020

Polymers

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In this study, a flame-retardant additive with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) groups denoted DSD was successfully synthesized from DOPO, 4,4′-diaminodiphenyl sulfone (DDS), and salicylaldehyde. The chemical structure of DSD was characterized by FTIR–ATR, NMR, and elemental analysis. DSD was used as an amine curing agent, and the transparent, tensile strength-enhanced epoxy resins named EP–DSD were prepared via thermal curing reactions among the diglycidyl ether of bisphenol A (DGEBA), 4,4′-diaminodiphenylmethane (DDM), and DSD. The flame-retardancy of composites was studied by the limiting oxygen index (LOI) and UL-94 test. The LOI values of EP–DSD composites increased from 30.7% for a content of 3 wt % to 35.4% for a content of 9 wt %. When the content of DSD reached 6 wt %, a V-0 rating under the UL-94 vertical test was achieved. SEM photographs of char residues after the UL-94 test indicate that an intumescent and tight char layer with a porous structure inside was formed. The TGA results revealed that EP–DSD thermosets decomposed ahead of time. The graphitization degree of the residual chars was also investigated by laser Raman spectroscopy. The measurement of tensile strength at breaking point shows that the loading of DSD increases the tensile strength of epoxy thermosets. Py-GC/MS analysis shows the presence of phosphorus fragments released during EP–DSD thermal decomposition, which could act as free radical inhibitors in the gas phase. Owing to the promotion of the formation of intumescent and compact char residues in the condensed phase and nonflammable phosphorus fragments formed from the decomposition of DOPO groups, EP–DSD composites displayed obvious flame-retardancy.

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Modified Epoxy Resin Synthesis from Phosphorus—Containing Polyol and Physical Changes Studies in the Synthesized Products

Cited by 4 publications

References 14 publications

Synthesis of Waterborne Polyurethane Using Phosphorus-Modified Rigid Polyol and its Physical Properties

Synthesis of Waterborne Polyurethane Using Phosphorus-Modified Rigid Polyol and its Physical Properties

Characterization of Hermetically Sealed Metallic Feedthroughs through Injection-Molded Epoxy-Molding Compounds

Flame-Retardant Performance of Transparent and Tensile-Strength-Enhanced Epoxy Resins

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