Modified gel casting technique to fabricate honeycomb structured vitrified-bonded ultrafine diamond grinding wheels

Miao, Weipeng; Ding, Youming; Zhao, Yanjun; Bao, Hua; Yan, Ning; Yang, Weijun; Ma, Zhen Hui; Liu, Bin

doi:10.1016/j.ceramint.2019.10.172

Cited by 18 publications

(3 citation statements)

References 32 publications

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“…The resulting mixture is then injected into molds and cold-pressed [13]. However, this approach has limitations in manufacturing complex-shaped grinding wheels due to the dependency on molds.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of vitrified bond diamond grinding wheel via UV-curing

Chen,

Xiao,

Han

et al. 2023

Preprint

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This paper presents an additive manufacturing UV-curing successful fabrication of vitrified bond diamond grinding wheel. High-performance vitrified bond was obtained by high-temperature melting of SiO2-B2O3-Al2O3-Na2O ceramic raw materials and used for grinding wheel preparation. UV-curing technology is characterized by high precision in shaping, fast processing speed, and superior quality, making it a promising technology for the fabrication of vitrified bond diamond grinding wheels. In order to meet the requirements for UV-curing of the grinding wheels, the preparation of vitrified bond slurry with high solid content and low viscosity was extensively investigated. The effects of dispersant, particle size of vitrified bond, and solid content on the viscosity of the slurry were systematically analyzed. Furthermore, in order to explore the optimal formulation of the grinding wheel, debinding and sintering conditions, sintering temperature, grit-to-bond ratio, and the evaluation of the grinding performance of the wheel on hard and brittle materials such as silicon carbide ceramic were studied. The results show that the vitrified bond diamond grinding wheel exhibits optimal comprehensive performance with a sintering temperature of 680°C and a grit-to-bond ratio of 7:3. The minimum surface roughness of the workpiece after grinding is 1.767 µm, the material removal rate is 5.08 mg/s, the grinding ratio is 9.78, and the friction coefficient is stabilized at about 0.5 during grinding. This paper provides guidance for the manufacture of vitrified bond diamond grinding wheels by UV-curing.

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Section: Introductionmentioning

confidence: 99%

Fabrication of vitrified bond diamond grinding wheel via UV-curing

Chen,

Xiao,

Han

et al. 2023

Preprint

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show abstract

“…In this process, diamond abrasives and vitrified bonds are weighed in specific proportions, and a temporary adhesive like dextrin powder or polyvinyl alcohol is utilized to bind the mixture. The resulting mixture is then injected into molds and cold-pressed [13]. However, this approach has limitations in manufacturing complex-shaped grinding wheels due to the dependency on molds.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of Vitrified Bond Diamond Grinding Wheel via LCD Photopolymerization

Chen,

Xiao,

Han

et al. 2023

Coatings

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In this paper, a liquid crystal display (LCD) photopolymerization method is proposed, and a vitrified bond diamond grinding wheel is successfully prepared. A high-performance vitrified bond was obtained by melting SiO2-B2O3-Al2O3-Na2O ceramic raw materials and used for grinding wheel preparation. LCD photopolymerization technology is characterized by high precision in shaping, fast processing speed, and superior quality, making it a promising technology for fabricating vitrified bond diamond grinding wheels. The preparation of vitrified bond slurry with high solid content and low viscosity was extensively investigated to meet the fabrication requirements. The effects of dispersant, the particle size of the vitrified bond, and solid content on the viscosity of the slurry were systematically analyzed. The vitrified bond slurry with solid content up to 65 wt.% (approximately 45.5 vol.%) was successfully prepared and met the requirements for printing. Furthermore, we explored the optimal formulation of the grinding wheel, debinding and sintering conditions, sintering temperature, grit-to-bond ratio, and the evaluation of the grinding performance of the wheel on hard and brittle materials, such as silicon carbide ceramic. Vitrified bond and abrasive slurry systems with a solid content of 65 wt.% (approximately 42.8 vol.%) were prepared. The results show that the vitrified bond diamond grinding wheel exhibits optimal comprehensive performance, with a sintering temperature of 680 °C and a grit-to-bond ratio of 4:6. The minimum surface roughness of the workpiece after grinding was 1.767 μm, the material removal rate was 5.08 mg/s, the grinding ratio was 9.78, and the friction coefficient was stabilized at about 0.5 during grinding. This paper guides the manufacturing of vitrified bond diamond grinding wheels via LCD photopolymerization.

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“…How to improve structure uniformity is the key to prepare the wheel for ultra-precision grinding of SiC wafers. To avoid agglomeration of ultrafine diamond particles and improve the surface roughness of silicon wafers, Miao et al 18 introduced a combination of gel casting and pore-forming agent to fabricate vitrified-bonded ultra-fine diamond grinding wheel with ultra-high porosity (up to 75%), the surface roughness R a and damaged layer of the ground Si wafers are approximately 5 nm and 0.21 mm respectively. Huang et al 19 developed sol-gel (SG) polishing pad based on the sodium alginate (AGS) binary compound system, which was used for polishing hard and brittle materials to obtain high-quality surfaces.…”

Section: Introductionmentioning

confidence: 99%

Ultra-precision grinding of 4H-SiC wafer by PAV/PF composite sol-gel diamond wheel

Feng

Zhao

Lyu

et al. 2021

Advances in Mechanical Engineering

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To eliminate the deep scratches on the 4H-SiC wafer surface in the grinding process, a PVA/PF composite sol-gel diamond wheel was proposed. Diamond and fillers are sheared and dispersed in the polyvinyl alcohol-phenolic resin composite sol glue, repeatedly frozen at a low temperature of −20°C to gel, then 180°C sintering to obtain the diamond wheel. Study shows that the molecular chain of polyvinyl alcohol-phenolic resin is physically cross-linked to form gel under low-temperature conditions. Tested by mechanical property testing machines, microhardness tester, and SEM. The results show that micromorphology is more uniform, the strength of the sol-gel diamond wheel is higher, the hardness uniformity is better than that of the hot pressing diamond wheel. Grinding experiments of 4H-SiC wafer were carried out with the prepared sol-gel diamond wheel. The influence of grinding speed, feed rate, and grinding depth on the surface roughness was investigated. The results showed that by using the sol-gel diamond wheel, the surface quality of 4H-SiC wafer with an average surface roughness Ra 6.42 nm was obtained under grinding wheel speed 7000 r/min, grinding feed rate 6 µm/min, and grinding depth 15 µm, the surface quality was better than that of using hot pressing diamond wheel.

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Modified gel casting technique to fabricate honeycomb structured vitrified-bonded ultrafine diamond grinding wheels

Cited by 18 publications

References 32 publications

Fabrication of vitrified bond diamond grinding wheel via UV-curing

Fabrication of vitrified bond diamond grinding wheel via UV-curing

Fabrication of Vitrified Bond Diamond Grinding Wheel via LCD Photopolymerization

Ultra-precision grinding of 4H-SiC wafer by PAV/PF composite sol-gel diamond wheel

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