The advancement of microelectronics technology has led to an increased demand for heat dissipation in devices. In response to this challenge, microchannel heat sinks (MCHS) have been introduced as a viable solution. The heat dissipation capabilities of MCHS can be enhanced by adopting pin fins, which serve to augment the solid-liquid contact area and disrupt the fluid boundary layer. Most research on MCHSs with pin fins has concentrated on vertical pin fin configurations, with a comparatively limited investigation into inclined pin fins. To further enhance the thermal performance of MCHS with pin fins, this study presents a novel MCHS with inclined pin fins (MCHS-IPF). The flow and heat transfer characteristics under steady-state conditions were analyzed using three-dimensional numerical simulations. Additionally, geomet-ric optimization was conducted on the tilt angle (θ: 30° to 30°, excluding 0°) and the secondary flow channel width ratio (β) to achieve improved overall performance. The results show that the MCHS-IPF sig-nificantly enhances thermal dissipation capability compared to a conventional MCHS with vertical pin fins (MCHS-VPF). As the tilt angle remains constant, the heat dissipation capacity of MCHS-IPF improves with an increase in β. The MCHS-IPF with β = 0.6 and θ = 30° at Re = 600 shows a notable enhancement of 57.7% in the Nusselt number compared to the MCHS-VPF. This MCHS-IPF, also demonstrates superior overall performance in this study, achieving a maximum Performance Evaluation Criteria of 1.53, thereby establishing itself as the optimal structure.