1981
DOI: 10.1007/bf00034500
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Modified sonic technique for crack velocity measurement

Abstract: Four modifications to the Kerkhof method of measuring crack velocities in glass greatly sharpened the timing Wallner lines and permitted measurements over the full range of crack velocities.

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Cited by 13 publications
(3 citation statements)
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“…Consequently, the moving crack will alternately propagate and arrest, leaving undulations on the fracture surface. 1,6 The interaction of the crack with material inhomogeneity also generates the waves with a wavelength of micrometers, millimeters or higher scales. [1][2][3][4] However, the origin of the fracture surface corrugations and the energy dissipation mechanism remain unclear.…”
mentioning
confidence: 99%
“…Consequently, the moving crack will alternately propagate and arrest, leaving undulations on the fracture surface. 1,6 The interaction of the crack with material inhomogeneity also generates the waves with a wavelength of micrometers, millimeters or higher scales. [1][2][3][4] However, the origin of the fracture surface corrugations and the energy dissipation mechanism remain unclear.…”
mentioning
confidence: 99%
“…This method is known by the name of its inventor, Kerkhof [4], and allows the determination of crack advance during a time equivalent to 1/f0. Judging from recent reports [5] which describe attempts to refine this method, the approach is still of current interest. The technique is of particular use for highspeed fracture.…”
Section: Fractographymentioning
confidence: 99%
“…These include direct real-time methods (multiple spark high-speed photography [11], pulsed laser high-speed photography [12] and holography [13,14], laser shadowing [15], and Rayleigh wave photography [15][16][17], direct post-mortem techniques (Wallner line fractography [ 18,19] and active ultrasonic fractography [20][21][22], and indirect real-time methods (potential drop [23,24], conductive mesh [25][26][27], and continuous conductive coating [4,28] techniques). These include direct real-time methods (multiple spark high-speed photography [11], pulsed laser high-speed photography [12] and holography [13,14], laser shadowing [15], and Rayleigh wave photography [15][16][17], direct post-mortem techniques (Wallner line fractography [ 18,19] and active ultrasonic fractography [20][21][22], and indirect real-time methods (potential drop [23,24], conductive mesh [25][26][27], and continuous conductive coating [4,28] techniques).…”
Section: Experimental Backgroundmentioning
confidence: 99%