Modular software system for computer aided design of microsystems

Straube, D.; Triltsch, U.; Franke, Hans‐Joachim; Büttgenbach, S.

doi:10.1007/s00542-006-0083-5

Cited by 2 publications

(4 citation statements)

References 6 publications

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“…Our software environment couples commercial system-level tools and several component level tools to form a closed design environment 8 . On the component level this system uses functional elements which contain a parameterized layout SPecificatioj and at least one fabrication sequence which has successfully been used to build this component.…”

Section: Introductionmentioning

confidence: 99%

TCAD tool for innovative MEMS and MOEMS: an all-in-one solution

Triltsch

Büttgenbach

2008

Micromachining and Microfabrication Process Technology XIII

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In this paper we present a TCAD tool for MEMS, which combines process and layout design and provides links to behavioral modeling tools as well as to specialized modules for the optimized design of single components. There is a large amount of new fabrication technologies available which make the design of highly innovative MEMS and MOEMS possible. The design of such systems not only incorporates the layout of masks but also involves the composition of a flawless process chain. TCAD tools for MEMS available today do mostly not support the design of new fabrication processes together with behavioral simulation and layout design. Therefore, there is a need for a methodical approach to component-design, which leads an engineer from single components to a system ready for fabrication. Based on a conceptual model for the design process the latest version of the modular software environment BICEP³S (Braunschweigs Integrated CAD-Environment for Product Planning Process Simulation) is explained. The concept and data model of building blocks on component level, that act as knowledge containers for fabrication ready functional elements of microsystems, are shown in detail. As the detailed simulation of single process steps is crucial in fabrication oriented design cycles, we present an atomistic etch-simulator as one example for specialized simulation modules of our design environment.

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Section: Introductionmentioning

confidence: 99%

TCAD tool for innovative MEMS and MOEMS: an all-in-one solution

Triltsch

Büttgenbach

2008

Micromachining and Microfabrication Process Technology XIII

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“…The first version of this simulator was developed from 1991 to 1994 [2]. In the past few years the model has been further enhanced and new features such as tolerance analysis of crucial parameters have been introduced [1]. This has made SUZANA one of the most accurate and flexible tools in this area available today.…”

Section: Design Environment Bicep³smentioning

confidence: 99%

“…There are two models available. If a less detailed model is sufficient, one macro cell of the model is formed by the eight corner points of one cubic cell (1)(2)(3)(4)(5)(6)(7)(8). In this case each of the corner atoms represents the eight atoms (5, b-h).…”

Section: A Simulation Modelmentioning

confidence: 99%

“…This TCAD tool consists of a series of modules [1] that integrate, for example, SoftMEMS systemlevel tools with detailed process simulators such as the etch simulator SUZANA [2] as well as process design tools with a link to process-, material-and media databases [3]. This approach combines system-level behavioral simulation and component-level design tools to provide engineers with a complete view of the overall design process.…”

Section: Introductionmentioning

confidence: 99%

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Next generation of TCAD environments for MEMS design

Triltsch

Büttgenbach

2008

2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

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Abstract-Most available MEMS design environments focus on the integrated behavioral simulation of electronic and mechanical components. The fabrication process is considered a fixed sequence of well-known steps, which can be purchased from foundries. Simulation models rely on the assumption of ideal process conditions and do not take into account tolerances or intra die variations.Recently there has been discussion that the gap between actual process results and that of predicted models are often out of a tolerable range. This leads to the demand of increased simulation accuracy for the most crucial process steps. The deviations of the comb structures in a resonator, which result from the tolerances in a Deep-RIE process, for example, can make the overall system design fail. To avoid these kinds of errors two things are needed: the technology provider has to know the parameter range of his process and be able to provide it to the designer without loosing his intellectual property. The designer in turn must be provided with a way to use this information to design a system which can perform in the range expected.In this paper we present the latest version of the TCAD environment BICEP³S (Braunschweigs Integrated CADEnvironment for Product Planning and Process Simulation). By using a central process database, which allows the exchange of all relevant process data it is able to overcome many of the mentioned obstacles. The database and process planning tool can be used by process developers to document changes in process settings and the influence of such changes on the process result. This information can then be used by the designers to set-up a simulation file for a detailed analysis of the impact of such parameter changes on the requested design. This will be shown by the example of silicon etching using an atomistic etch simulator.

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Modular software system for computer aided design of microsystems

Cited by 2 publications

References 6 publications

TCAD tool for innovative MEMS and MOEMS: an all-in-one solution

TCAD tool for innovative MEMS and MOEMS: an all-in-one solution

Next generation of TCAD environments for MEMS design

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