2020
DOI: 10.1177/0021998320951888
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Modulation and mechanism of spatial structure for multi-layer cyanate ester resin composites to achieve remarkably increased energy storage density and decreased dielectric loss

Abstract: Overcoming sticky problems of large dielectric loss and poor breakdown strength ( Eb) is prerequisite of actual applications for high dielectric constant polymer composites. Herein, three kinds of multi-layer structure composites with different spatial structures (2MP-CE/CNT, CE/CNT-2MP-CE/CNT, MP-CE/CNT-MP) were prepared based on carbon nanotubes (CNTs), cyanate ester (CE) resin and mica paper (MP). Compared with traditional single-layer CE/CNT composite, multi-layer CE/CNT-2MP-CE/CNT composites, of which the… Show more

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Cited by 8 publications
(4 citation statements)
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“…In this work, a novel branched fluorinate‐adamantane PBO precursor ( pre FABPBO) obtained by random co‐condensation between 2,2‐bis(3‐amino‐4‐hydroxyphenyl)hexafluoro propane, 1,3‐adamantanedicarbonyl dichloride, and trimesoyl chloride is used as interfacial compatibilizers, BADCy resin [ 39‐41 ] as polymer matrix, and PBO fibers as the reinforcements, and PBO fibers/ FABPBO‐BADCy wave‐transparent laminated composites are then prepared by the method of high‐temperature molding. The introduction of the PBO‐like structures in pre FABPBO enhanced the interfacial bonding strength of PBO fibers/BADCy composites.…”
Section: Background and Originality Contentmentioning
confidence: 99%
“…In this work, a novel branched fluorinate‐adamantane PBO precursor ( pre FABPBO) obtained by random co‐condensation between 2,2‐bis(3‐amino‐4‐hydroxyphenyl)hexafluoro propane, 1,3‐adamantanedicarbonyl dichloride, and trimesoyl chloride is used as interfacial compatibilizers, BADCy resin [ 39‐41 ] as polymer matrix, and PBO fibers as the reinforcements, and PBO fibers/ FABPBO‐BADCy wave‐transparent laminated composites are then prepared by the method of high‐temperature molding. The introduction of the PBO‐like structures in pre FABPBO enhanced the interfacial bonding strength of PBO fibers/BADCy composites.…”
Section: Background and Originality Contentmentioning
confidence: 99%
“…Epoxy resin (EP) is extensively employed in diverse fields, including electronics, coatings, and adhesives, owing to its outstanding mechanical performance, good corrosion resistance, and superior adhesion capabilities. [1][2][3] However, in light of the rapid progress in communication technology (i.e., 5G), there arises a demand for epoxy resin (EP) to exhibit supplementary attributes, for example, excellent thermal properties, low relative permittivity, low dissipation factor, and so on. To meet these requirements for EP, a promising strategy is to…”
Section: Introductionmentioning
confidence: 99%
“…In recent years, a significant amount of research has focused on materials that can be used for dielectrics in electrical insulation and energy storage devices that can be used in the next generation of electronics. Such efforts have focused on the improvement of these materials’ polarization, , dielectric loss, and dielectric breakdown strength, which have been in response to the rapid development of various types of high-voltage electronics (e.g., electric motors). Of particular interest are insulating dielectric materials that are thinner and can withstand higher voltages (i.e., have higher breakdown strengths) .…”
Section: Introductionmentioning
confidence: 99%