“…In order to overcome these problems, higher permittivity (k) materials, which allows an equivalent capacitance to be achieved using a physically thicker insulating layer, can replace the conventional SiO 2 gate dielectric to realize further scaling down. Therefore, in the past several years, much attention have been given to alternative high-k dielectric oxides such as silicates (e.g., Zr and Hf silicate [27,28]), single metal oxides (e.g., HfO 2 [29], ZrO 2 [30], Al 2 O 3 [31], La 2 O 3 [32], Pr 2 O 3 [33], Y 2 O 3 [34], Gd 2 O 3 [35], Nd 2 O 3 [36]), and binary metal oxides [37][38][39][40]. In order to meet the requirements of CMOS field effect transistors, the high-k dielectrics should satisfy some requirements, as summarized in the Table 1 [41].…”