Module packaging effects on MEMS airbag sensor performance for automobiles

Park, Dong Hyun; Shin, Sojin; Kim, Yeong K.

doi:10.1016/j.microrel.2017.07.051

Cited by 16 publications

(5 citation statements)

References 19 publications

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“…In this paper, the authors discussed about low temperature bonding with Ti/Au and Ti/Pt/Au thin films. [18] Plastic --A novel plastic packaging method was proposed for MEMS devices.…”

Section: Refmentioning

confidence: 99%

Electrostatic and Electromagnetic Parametric Analysis of RF MEMS Switches for Reconfigurable Antenna

Sathuluri,

2023

Preprint

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This work presents RF MEMS switch design, packaging and incorporation in patch antenna. Electrostatic and Electromagnetic parametric analysis is performed. The RF MEMS switch packaging aspects also highlight. Novel configuration of MEMS switch, and antenna performance was studied in 0.5–40 GHz frequency range. A modified serpentine membrane is designed and simulated, offering a low actuation voltage of 5 V, switching time of 100 µs, and damping duration is 1.6 ms. The switch design is extended up to packaging by extracting contacts. Diamond shape patch is considered for antenna design. Two identical switches are used to design a reconfigurable antenna, where frequency reconfigurability is analyzed under different switching conditions. The proposed antenna is found suitable for X, and K band applications

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“…In this paper, the authors discussed about low temperature bonding with Ti/Au and Ti/Pt/Au thin films. [18] Plastic --A novel plastic packaging method was proposed for MEMS devices.…”

Section: Refmentioning

confidence: 99%

Electrostatic and Electromagnetic Parametric Analysis of RF MEMS Switches for Reconfigurable Antenna

Sathuluri,

2023

Preprint

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“…In order to understand the vibration effects of packaged components and structures, he also performed numerical analysis. Although he proved that the vibration characteristics of the frame structure and the module housing and the module installation position have a significant impact on the generation of shock signals, the content of numerical analysis is lacking [3]. Huang H believes that the dual-axis scanning mirror assembly (TSAY) is a key component of the optoelectronic system, which is usually used for precise positioning, tracking, scanning and stabilization of the line of sight (LOS).…”

Section: Introductionmentioning

confidence: 99%

Simulation of gymnastics performance based on MEMS sensor

Chen

Kuang

2021

EURASIP J. Adv. Signal Process.

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The development and progress of multi-sensor data fusion theory and methods have also laid the foundation for the research of human body posture tracking system based on inertial sensing. The main research in this paper is the simulation of gymnastics performance based on MEMS sensors. In the preprocessing to reduce noise interference, this paper mainly uses median filtering to remove signal glitches. This article uses virtual character models for gymnastics performances. The computer receives sensor data from the sink node of the motion capture device through a Bluetooth communication module. The unit calculates the quaternion output from the dynamic link library of sensor data processing, calculates the rotation amount and coordinate offset of each sensor node’s limb, and uses the character model to realize the real-time rendering of the virtual character model. At the same time, it controls the storage of sensor data, the drive of the model, and the display of the graphical interface. When a gesture action is about to occur, a trigger signal is given to the system to mark the beginning of the action, so as to obtain the initial data of each axis signal of the MEMS sensor. When the gesture action is completed, give the system a signal to end the action. Mark the end of the action, so that you can capture the original signal data during the beginning and end of the gesture action. In order to ensure the normal communication between PS and PL, it is necessary to test the key interfaces involved. Because the data received by the SPI acquisition module is irregular, it is impossible to verify whether the data is wrong, so the SPI acquisition module is replaced with a module that automatically increments data, and the IP core is generated, and a test platform is built for testing. The data shows that the average measurement error of X-axis displacement of the space tracking system is 8.17%, the average measurement error of Y-axis displacement is 7.51%, the average measurement error of Z-axis displacement is 9.72%, and the average error of three-dimensional space measurement is 8.7%. The results show that the MEMS sensor can accurately recognize the action with high accuracy.

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“…Acceleration sensors are usually fabricated using microelectromechanical systems (MEMS) technology [1][2][3][4][5]. They have been applied to the fields of automobile [1,5], healthcare [2], mobile devices [3], and electronic devices [4].…”

Section: Introductionmentioning

confidence: 99%

“…Acceleration sensors are usually fabricated using microelectromechanical systems (MEMS) technology [ 1 , 2 , 3 , 4 , 5 ]. They have been applied to the fields of automobile [ 1 , 5 ], healthcare [ 2 ], mobile devices [ 3 ], and electronic devices [ 4 ]. MEMS acceleration sensors are divided into capacitive [ 6 , 7 ], piezoelectric [ 8 , 9 ], piezoresistive [ 10 , 11 ], Hall effect [ 12 , 13 ], magnetoresistive [ 14 , 15 ] and heat transfer [ 16 , 17 ] types according to the sensing method used.…”

Section: Introductionmentioning

confidence: 99%

Cantilever Type Acceleration Sensors Made by Roll-to-Roll Slot-Die Coating

Lee

2020

Sensors

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This paper presents the fabrication by means of roll-to-roll slot-die coating and characterization of air gap-based cantilever type capacitive acceleration sensors. As the mass of the sensor moves in the opposite direction of the acceleration, a capacitance change occurs. The sensor is designed to have a six layers structure with an air gap. Fabrication of the air gap and cantilever was enabled by coating and removing water-soluble PVA. The bottom electrode, the dielectric layer, and the sacrificial layer were formed using the roll-to-roll slot-die coating technique. The spacer, the top electrode, and the structural layer were formed by spin coating. Several kinds of experiments were conducted for characterization of the fabricated sensor samples. Experimental results show that accelerations of up to 3.6 g can be sensed with an average sensitivity of 0.00856 %/g.

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Module packaging effects on MEMS airbag sensor performance for automobiles

Cited by 16 publications

References 19 publications

Electrostatic and Electromagnetic Parametric Analysis of RF MEMS Switches for Reconfigurable Antenna

Electrostatic and Electromagnetic Parametric Analysis of RF MEMS Switches for Reconfigurable Antenna

Simulation of gymnastics performance based on MEMS sensor

Cantilever Type Acceleration Sensors Made by Roll-to-Roll Slot-Die Coating

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