Moisture diffusion monitoring in globtop encapsulant with microdielectric sensors

Tong, Woody Y. Y.; Teng, A.

doi:10.1109/emap.2000.904200

Cited by 8 publications

(1 citation statement)

References 8 publications

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“…Another method to monitor moisture diffusion in epoxy uses a dielectric analyzer (DEA), which is based on the principle that absorbed moisture increases the dielectric constant of epoxy materials. 2…”

Section: Introductionmentioning

confidence: 99%

Study on mobility of water and polymer chain in epoxy and its influence on adhesion

Luo

Leisen

Wong

2002

J of Applied Polymer Sci

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This paper presents a study on the mobility of water and polymer chains in epoxy materials and its influence on the rate of adhesion degradation in a humid environment. Solid state nuclear magnetic resonance (NMR) techniques (both 1 H NMR and 2 H NMR) were used to study the binding states of water within two epoxy formulations along with the possible plasticizing effects of moisture affecting the mobility of polymer chains. Absorbed water reduces the glass transition temperature of polymeric materials. However, the presence of moisture has no significant effect on the polymer chain mobility at temperatures below the reduced glass transition temperature. Water in an epoxy in its rubbery state above the glass transition has a much higher mobility than in a polymer in its glassy state. The mobility of water absorbed by a polymer in its rubbery state is similar to that of pure water. The translational mobility of water within epoxies was studied by measuring the diffusion coefficient of water in epoxies through the water uptake. Higher rotational mobilities of water and polymer chains in the rubbery state lead to a significant increase of the water diffusion coefficient in the rubbery state polymer matrix as compared to a polymer in its glassy state. The higher mobility of absorbed water and the higher mobility of polymer chains in epoxy lead to faster adhesion degradation during aging in a humid environment.

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Section: Introductionmentioning

confidence: 99%

Study on mobility of water and polymer chain in epoxy and its influence on adhesion

Luo

Leisen

Wong

2002

J of Applied Polymer Sci

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Recent Advances in Encapsulation of Flexible Bioelectronic Implants: Materials, Technologies, and Characterization Methods

Mariello

Kim

et al. 2022

Advanced Materials

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Bioelectronic implantable systems (BIS) targeting biomedical and clinical research should combine long‐term performance and biointegration in vivo. Here, recent advances in novel encapsulations to protect flexible versions of such systems from the surrounding biological environment are reviewed, focusing on material strategies and synthesis techniques. Considerable effort is put on thin‐film encapsulation (TFE), and specifically organic–inorganic multilayer architectures as a flexible and conformal alternative to conventional rigid cans. TFE is in direct contact with the biological medium and thus must exhibit not only biocompatibility, inertness, and hermeticity but also mechanical robustness, conformability, and compatibility with the manufacturing of microfabricated devices. Quantitative characterization methods of the barrier and mechanical performance of the TFE are reviewed with a particular emphasis on water‐vapor transmission rate through electrical, optical, or electrochemical principles. The integrability and functionalization of TFE into functional bioelectronic interfaces are also discussed. TFE represents a must‐have component for the next‐generation bioelectronic implants with diagnostic or therapeutic functions in human healthcare and precision medicine.

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Study on mobility of water and polymer chain in epoxy for microelectronic applications

Luo

Leisen²,

Wong³

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)

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Moisture diffusion monitoring in globtop encapsulant with microdielectric sensors

Cited by 8 publications

References 8 publications

Study on mobility of water and polymer chain in epoxy and its influence on adhesion

Study on mobility of water and polymer chain in epoxy and its influence on adhesion

Recent Advances in Encapsulation of Flexible Bioelectronic Implants: Materials, Technologies, and Characterization Methods

Study on mobility of water and polymer chain in epoxy for microelectronic applications

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