2006
DOI: 10.1007/s11837-006-0064-2
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Moisture-induced delayed spallation and interfacial hydrogen embrittlement of alumina scales

Abstract: High-Temperature Protection Research Summary

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Cited by 39 publications
(40 citation statements)
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“…This had been discussed in prior works [5,12,15,16] where there is general agreement that moisture causes a decrease in interfacial toughness between the scale and metal. The mechanism accounting for the decrease is under investigation, and one proposition is hydrogen embrittlement at the interface [17]. The rationale stems from the close analogy to moisture-induced hydrogen embrittlement features for intermetallic compounds.…”
Section: High Temperature Corrosion and Protection Of Materialsmentioning
confidence: 99%
See 3 more Smart Citations
“…This had been discussed in prior works [5,12,15,16] where there is general agreement that moisture causes a decrease in interfacial toughness between the scale and metal. The mechanism accounting for the decrease is under investigation, and one proposition is hydrogen embrittlement at the interface [17]. The rationale stems from the close analogy to moisture-induced hydrogen embrittlement features for intermetallic compounds.…”
Section: High Temperature Corrosion and Protection Of Materialsmentioning
confidence: 99%
“…The rationale stems from the close analogy to moisture-induced hydrogen embrittlement features for intermetallic compounds. To test this hypothesis, very adherent pre-oxidized samples of Rene′N5+80 ppmw Y, hydrogen annealed at 1250°C for 100 hr., were subjected to an electrolytic cathodic hydrogen charging procedure [17]. The current-voltage response profile was first established, showing relatively low 1 mA currents at less than 2.0 V cathodic (-) polarization or less than 1.3 V anodic (+) for coupons It can be seen that only eqn.…”
Section: High Temperature Corrosion and Protection Of Materialsmentioning
confidence: 99%
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“…1 This is a serious concern that needs to be addressed. Another major issue with respect to durability is the build up and relaxation of thermal stresses within the multilayers of TBCs upon thermal cycling of these components.…”
Section: Oxide Layersmentioning
confidence: 99%