Moisture ingress into organic laminates

Pecht, Michael; Ardebili, Haleh; Shukla, Arun; Hagge, J.K.; Jennings, D. A.

doi:10.1109/6144.759359

Cited by 37 publications

(8 citation statements)

References 7 publications

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“…Among the material parameters in finite element analysis (FEA), the moisture diffusion coefficient of the Si chip is fixed at 1.0E-30 mm 2 /s and that of the PCB can be obtained from Ref. 6, while that of the globtop (D gt ) is unknown. Among applied loads in FEA, the saturated water-vapor concentration of the globtop (C gt ) can directly be obtained from the experimental data, while that of PCB (C pcb ) is unknown.…”

Section: Diffusion Model and Finite Element Analysis For Moisture Difmentioning

confidence: 99%

Effect of organic/inorganic coating on moisture diffusion in a chip-on-board package with globtop

Huang

Wang²,

Wang³

et al. 2004

Journal of Elec Materi

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The moisture diffusion in globtop material for a chip-on-board (COB) package coated with SiN x and silicone, respectively, or coated with SiN x plus silicone were measured by embedding a humidity sensor in the globtop and recording the capacitive change in three different temperature/humidity environments. The experimental results were simulated by Fick's diffusion law with finiteelement method modeling. The moisture diffusion coefficients and activation energies were calculated to quantitatively compare the moisture-resistance effects of different coatings. For example, at 85°C/85% RH, the moisture diffusion coefficients for the uncoated reference, SiN x -coated, silicone-coated, and silicone/SiN x double-layered coated samples are 1E-5, 0.8E-5, 0.7E-5, and 0.2E-5 mm 2 /s, respectively. The experimental and simulation results show that double-layered coating with silicone/SiN x has excellent moisture-resistance properties because it not only smoothes the steps on a printed circuit board (PCB) but also keeps the good moisture resistance of the inorganic films.

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Section: Diffusion Model and Finite Element Analysis For Moisture Difmentioning

confidence: 99%

Effect of organic/inorganic coating on moisture diffusion in a chip-on-board package with globtop

Huang

Wang²,

Wang³

et al. 2004

Journal of Elec Materi

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show abstract

“…Often the device electrical performance fails specifi cation long before catastrophic conductor damage occurs. 5,6 For these reasons, early electronic systems for military applications were designed to a limit of 5000 ppm moisture so that the dew point was below freezing. 7…”

Section: 2mentioning

confidence: 99%

Validating hermeticity in welded metallic implantable medical devices

Ely

2013

Joining and Assembly of Medical Materials and Devices

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“…Therefore the vibration and mechanical energy transmission mechanism varies widely between different electronic systems. Additionally, the properties of PCB materials can change in response to various stimuli, such as moisture [9]. An illustration of a cross-section of a 2-layer PCB is presented in Figure 1.…”

Section: Printed Circuit Boardsmentioning

confidence: 99%

Microfibrous metallic cloth for damping enhancement in printed circuit boards

Burch

Black

Dean

et al. 2010

Active and Passive Smart Structures and Integrated Systems 2010

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As a result of the relatively low intrinsic damping in printed circuit boards, vibration and acoustic energy present in the operating environment may excite vibration modes in the PCB that lead to deleterious effects in attached vibration sensitive components, such as MEMS gyroscopes. An investigation of the use of sandwiched layers of microfibrous metallic cloth in contact with the PCB to increase damping was investigated. Tests were performed for both vibration excitation and acoustic excitation. The initial results indicate that mechanical damping can be increased through this approach.

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Moisture ingress into organic laminates

Cited by 37 publications

References 7 publications

Effect of organic/inorganic coating on moisture diffusion in a chip-on-board package with globtop

Effect of organic/inorganic coating on moisture diffusion in a chip-on-board package with globtop

Validating hermeticity in welded metallic implantable medical devices

Microfibrous metallic cloth for damping enhancement in printed circuit boards

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