Moisture resistance evaluation on single electronic package moulding compound

Tan, Cher Ming; Narula, Udit; Seow, Guan Ling; Sangwan, Vivek; Chen, Ching Hsiang; Lin, San‐Yih; Chen, Jia Yuan

doi:10.1039/c9tc04298a

Cited by 4 publications

(5 citation statements)

References 27 publications

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“…The contact angle reaches 86.8° when the content of FG is 2.5 wt %, indicating that FG can sensibly alleviate the water repellency of the films . The improvement of hydrophobic property is more beneficial to the application of composite films in the field of electronic packaging …”

Section: Results and Discussionmentioning

confidence: 99%

“…50 The improvement of hydrophobic property is more beneficial to the application of composite films in the field of electronic packaging. 48 3.5. Thermal Properties of PI Composites.…”

Section: Morphologies Of Pi Nanocompositesmentioning

confidence: 99%

“…47 The water absorption will seriously affect the performance and life of microelectronic packaging materials, such as the deterioration of insulation and thermal conductance, even sometimes causing a short circuit. 48 PI is used in the field of microelectronics as a promising material, but it has high water absorption (1−3%) because of the existence of polar carbonyl groups. 49 Fluorinated PI is considered to be a substitute for PI owing to its lower hygroscopic rate.…”

Section: Morphologies Of Pi Nanocompositesmentioning

confidence: 99%

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Polyimide Composites with Fluorinated Graphene and Functionalized Boron Nitride Nanosheets for Heat Dissipation

Zhang,

Wang,

et al. 2024

ACS Appl. Nano Mater.

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Polyimide (PI) with excellent comprehensive properties has been extensively applied in electronic devices. The miniaturization and integration of electrical equipment put forward more stringent requirements for heat dissipation, so a composite with high thermal conductivity and low dielectric properties has become a critical factor. In this work, fluorinated graphene (FG) and boron nitride nanosheets modified with polydopamine (PDA@BNNS) were filled into the PI matrix as fillers to prepare FG/PDA@BNNS/PI composites. The mixed filling of FG and BNNS synergistically improves the dielectric and thermal conductivity, and this research breaks the balance barrier between dielectric and thermal conductivity. The resulting 4.99 wt % FG/PDA@BNNS/PI composite exhibited excellent comprehensive properties, including ultralow dielectric constant of 1.67, low loss of 0.013 at 1 MHz, and high thermal conductivity of 2.464 W m–1 K–1. In addition, the film also showed standout breakdown resistance (81.22 kV/mm) and mechanical properties such that the tensile strength reached 35.7 MPa. This report can inspire future development of composites for electronic packaging.

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Section: Results and Discussionmentioning

confidence: 99%

“…50 The improvement of hydrophobic property is more beneficial to the application of composite films in the field of electronic packaging. 48 3.5. Thermal Properties of PI Composites.…”

Section: Morphologies Of Pi Nanocompositesmentioning

confidence: 99%

Section: Morphologies Of Pi Nanocompositesmentioning

confidence: 99%

See 1 more Smart Citation

Polyimide Composites with Fluorinated Graphene and Functionalized Boron Nitride Nanosheets for Heat Dissipation

Zhang,

Wang,

et al. 2024

ACS Appl. Nano Mater.

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show abstract

Section: Resultsmentioning

confidence: 99%

“…The water absorption will seriously affect the performance and life of microelectronic packaging materials, such as the deterioration of insulation and thermal conductance, even sometimes causing short circuit. 29 The water contact angles of the both fillers were measured to assess the hydrophobicity alteration of the fillers after alkylation modification. Previous study 30 indicates that the BNNSs obtained through ultrasonic stripping of h-BN using DMF possess a limited number of hydroxyl groups, resulting in a certain degree of hydrophilicity.…”

Section: Structural Characterization Of Alkyl-bnnsmentioning

confidence: 99%

Multifunctional boron nitride nanosheets/fluorinated‐polyimide composites with ultra‐low dielectric constant and high thermal conductivity

Zhang,

Wang,

et al. 2024

Polymer Composites

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Thermally conductive polymeric composites with low dielectric constant are highly promising for the packaging materials in the field of modern communication. Therefore, the synergistic improvement of low dielectric constant and high thermal conductivity has become a current research hotspot. In this work, we propose a one‐step alkylation of boron nitride nanosheet (BNNS) with ultrasonic stratification using 1‐hexanol, and then hot press the films to make Alkyl‐BNNSs orient in the fluorinated polyimide (f‐PI). The resulting Alkyl‐BNNS/f‐PI composite successfully realizes the synergistic improvement of thermal property and dielectric properties, exhibiting a high heat conductivity coefficient of 2.36 Wm−1 K−1 with a filler content of 4.99 wt.%. Moreover, the permittivity and dielectric loss of the film are as low as 1.76 and 0.0065 at 1 MHz, respectively. This work provides a facile strategy for breaking the bottleneck of making polyimide composites simultaneously with high thermal conduction and low dielectric performance.Highlights The composite exhibits a high heat‐conducting coefficient of 2.36 Wm−1 K−1. Ultra‐low dielectric constant of 1.76 was achieved by the modification of film. Excellent breakdown resistance and flexibility were endowed with the composites.

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Ultra-low dielectric constant fluorinated graphene/polybenzoxazole composite films with excellent thermal stabilities and mechanical properties

et al. 2021

Composites Part A: Applied Science and Manufacturing

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Moisture resistance evaluation on single electronic package moulding compound

Abstract: Non-destructive evaluation indices that correlate with the moisture resistance of integrated circuit packages are developed.

Cited by 4 publications

References 27 publications

Polyimide Composites with Fluorinated Graphene and Functionalized Boron Nitride Nanosheets for Heat Dissipation

Polyimide Composites with Fluorinated Graphene and Functionalized Boron Nitride Nanosheets for Heat Dissipation

Multifunctional boron nitride nanosheets/fluorinated‐polyimide composites with ultra‐low dielectric constant and high thermal conductivity

Ultra-low dielectric constant fluorinated graphene/polybenzoxazole composite films with excellent thermal stabilities and mechanical properties

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