Molding compound trends in a denser packaging world: qualification tests and reliability concerns

Nguyen, Luu; Lo, Roger; Chen, A.S.; Belani, J.G.

doi:10.1109/24.273570

Cited by 19 publications

(5 citation statements)

References 19 publications

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“…Typically, a small amount of moisture inside the chip and moisture entered the package during the manufacturing process becomes expanded by heat generated during the chip operation to form a high pressure inside the chip. This pressure is placed mainly on the downward of the Die Pad and gives stress on the sideways or downward of the pad to generate delamination and crack [3]. The lower the temperature rapidly drops, the more frequently delamination and crack are generated [7].…”

Section: Results Analysis Of the Accelerated Life Testingmentioning

confidence: 99%

“…Crack induced by hightemperature pressure is developed into delamination, and ingress of moisture into the package takes place due to this delamination. Thus the delamination with moisture ingress leads to short circuit by corrosion [3,4]. The failure modes of the Bluetooth module can be divided into 'short' in which no more output voltage is supplied due to blocked current, 'open' under which only difference between potentials exists without any current flow so that there is no way those potentials go to and 'degradation' of electrical characteristics due to the increase in resistance in the semiconductor.…”

Section: B Failure Analysismentioning

confidence: 99%

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Lifetime Estimation of a Bluetooth Module for Ubiquitous Systems

Kim

Son

Shin

2009

Proceedings of the 4th International Conference on Ubiquitous Information Technologies &Amp; Applications

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Information processing has been thought of as a key to ubiquitous systems. Operating systems composing ubiquitous systems are also important since ubiquitous systems do not provide desired performance when the operating systems fail. Bluetooth module becomes a critical item for these operating systems. Thus, accurate reliability estimation of the module under various environmental conditions is required for profitable ubiquitous system development. This paper shows quantitative reliability evaluation results of a Bluetooth module through extending previous qualitative methods limited to structure reliability tests and solder joint reliability tests for Bluetooth modules. Accelerated Life Testing (ALT) of the modules using temperature difference in temperature cycling as an accelerated stress was conducted for quantitative reliability evaluation under field environment conditions. Lifetime distribution parameters were estimated using the failure times obtained through the ALT, and then Coffin-Manson model was implemented. Results of the ALT showed that the failure mode of the modules was open and the failure mechanisms are both crack and delamination. The ALT reproduced the failure mode and mechanisms of failed Bluetooth modules collected from the field. Further, a quantitative reliability evaluation method with respect to various temperature differences in temperature cycling was proposed in this paper. B10 lifetime of the module for the temperature difference 70oC using the proposed method would be estimated as about 4 years.

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Section: Results Analysis Of the Accelerated Life Testingmentioning

confidence: 99%

Section: B Failure Analysismentioning

confidence: 99%

Lifetime Estimation of a Bluetooth Module for Ubiquitous Systems

Kim

Son

Shin

2009

Proceedings of the 4th International Conference on Ubiquitous Information Technologies &Amp; Applications

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“…Introduction of thinner packages has imposed stringent functional requirements on compounds such as moisture resistance, high anti-popcorn cracking toughness, and better moldability [2]. Qualifying tests mirror the advances in epoxy and compounding technologies.…”

Section: Molding Compoundsmentioning

confidence: 99%

A review of non-hermetic optoelectronic packaging

Madduri

Sammakia

Infantolino

et al. 2008

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

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This paper is a summary of a literature survey done on nonhermetic optoelectronic packages focusing on the cost and reliability aspects. The development of reliable non-hermetic lasers would not only lead to the elimination of the costs specifically associated with hermetic packaging but also lead the way for possible revolutionary low-cost optoelectronic packaging technologies. The paper starts with an introduction to the concept of hermeticity in optoelectronic packages, followed by a detailed review of the reliability issues and failure mechanisms observed in non-hermetic packages when compared to their hermetic counter parts. A hermetic seal in electronic packages is used to prevent the entry of air, foreign gases, contaminants, and most importantly moisture. To seal a package hermetically is particularly challenging and expensive. There are various techniques that have been investigated, to improve the reliability of non-hermetic packages. A few are discussed here such as facet passivation type, choosing a better optical glass and encapsulation techniques. Also accelerated testing is discussed. Some of the most common and important failure mechanisms like popcorn failure, adhesive degradation, laser misalignment and epoxy swelling are discussed.

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“…Table 7.6 provides a listing of typical stresses, levels, and durations [52][53][54]. A wide variety of accelerated tests-involving various stress levels and combinations of stresses-are used by device manufactures.…”

Section: Industry Practicesmentioning

confidence: 99%