2005
DOI: 10.1103/physrevb.72.094105
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Molecular dynamics investigation of dislocation pinning by a nanovoid in copper

Abstract: Interactions between an edge dislocation and a void in copper are investigated by means of molecular dynamics simulation. The depinning stresses of the leading partial and of the trailing partial show qualitatively different behaviors. The depinning stress of the trailing partial increases logarithmically with the void radius, while that of the leading partial shows a crossover at 1 nm above which two partials are simultaneously trapped by the void. The pinning angle, which characterizes the obstacle strength,… Show more

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Cited by 78 publications
(58 citation statements)
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“…When dislocation can penetrate a periodic array of particles, the critical depinning stress c  can be estimated to be [42][43][44] …”
Section: Details Of MD Simulationsmentioning
confidence: 99%
“…When dislocation can penetrate a periodic array of particles, the critical depinning stress c  can be estimated to be [42][43][44] …”
Section: Details Of MD Simulationsmentioning
confidence: 99%
“…The dynamics of edge dislocations in close-packed materials under dynamic loading has been studied earlier in the frames of classical molecular dynamics (CMD) by other researchers [1][2][3][4][5][6][7] as following. Typical scheme of the simulation model is presented in Fig.…”
Section: Traditional Methods Of Edge Dislocation Dynamics Simulationsmentioning
confidence: 99%
“…Fully atomistic methods have become an indispensible tool for providing direct physical insight into the mechanistic role of defects in materials [1][2][3][4][5][6]. Molecular statics simulations have been used extensively to study grain boundaries [7][8][9], dislocation cross-slip [10][11][12], crack tips [13,14], and dislocation/obstacle interactions [1-3, 5, 6, 15-33].…”
Section: Introductionmentioning
confidence: 99%