Molecular Dynamics Modeling of Nanoscale Machining of Silicon

Olufayo, Oluwole A.; Abou-El-Hossein, Khaled

doi:10.1016/j.procir.2013.06.141

Cited by 16 publications

(8 citation statements)

References 8 publications

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“…As part of the experiment, the authors investigated the relationship between the cutting edge radius and the minimum uncut chip thickness, as well as the chip formation process and deformations of the subsurface layer. In the following years, many studies of the nanometric cutting process were carried out using MD methods [ 55 , 56 ]. These works concerned only nanoscale cutting (with thicknesses of cut in the range of several nanometers).…”

Section: Simulation/numerical Methods For Minimum Uncut Chip Thickness Determinationmentioning

confidence: 99%

Estimation of Minimum Uncut Chip Thickness during Precision and Micro-Machining Processes of Various Materials—A Critical Review

Wojciechowski

2021

Materials

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Evaluation of the phenomena characterizing the chip decohesion process during cutting is still a current problem in relation to precision, ultra-precision, and micro-machining processes of construction materials. The reliable estimation of minimum uncut chip thickness is an especially challenging task since it directly affects the machining process dynamics and formation of a surface topography. Therefore, in this work a critical review of the recent studies concerning the determination of minimum uncut chip thickness during precision, ultra-precision, and micro-cutting is presented. The first part of paper covers a characterization of the precision, ultra-precision, and micro-cutting processes. In the second part, the analytical, experimental, and numerical methods for minimum uncut chip thickness estimation are presented in detail. Finally, a summary of the research results for minimum uncut chip thickness estimation is presented, together with conclusions and a determination of further research directions.

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Section: Simulation/numerical Methods For Minimum Uncut Chip Thickness Determinationmentioning

confidence: 99%

Estimation of Minimum Uncut Chip Thickness during Precision and Micro-Machining Processes of Various Materials—A Critical Review

Wojciechowski

2021

Materials

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“…This simulation technique is an important method used in the atomic scale process due to its high efficiency in this field [187]. This approach is used to model and simulate scratching the polycrystalline and monocrystalline silicon carbide with diamond grit to predict the behavior of the material removal [188][189][190]. This method is also used in simulating the process of copper milling as it has proved its efficiency in investigating the deformation in copper machining [191].…”

Section: Prepare For System Setup Energy Minimizationmentioning

confidence: 99%

Understanding the Mechanism of Abrasive-Based Finishing Processes Using Mathematical Modeling and Numerical Simulation

Hashmi

Mali

Meena

et al. 2022

Metals

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Recent advances in technology and refinement of available computational resources paved the way for the extensive use of computers to model and simulate complex real-world problems difficult to solve analytically. The appeal of simulations lies in the ability to predict the significance of a change to the system under study. The simulated results can be of great benefit in predicting various behaviors, such as the wind pattern in a particular region, the ability of a material to withstand a dynamic load, or even the behavior of a workpiece under a particular type of machining. This paper deals with the mathematical modeling and simulation techniques used in abrasive-based machining processes such as abrasive flow machining (AFM), magnetic-based finishing processes, i.e., magnetic abrasive finishing (MAF) process, magnetorheological finishing (MRF) process, and ball-end type magnetorheological finishing process (BEMRF). The paper also aims to highlight the advances and obstacles associated with these techniques and their applications in flow machining. This study contributes the better understanding by examining the available modeling and simulation techniques such as Molecular Dynamic Simulation (MDS), Computational Fluid Dynamics (CFD), Finite Element Method (FEM), Discrete Element Method (DEM), Multivariable Regression Analysis (MVRA), Artificial Neural Network (ANN), Response Surface Analysis (RSA), Stochastic Modeling and Simulation by Data Dependent System (DDS). Among these methods, CFD and FEM can be performed with the available commercial software, while DEM and MDS performed using the computer programming-based platform, i.e., “LAMMPS Molecular Dynamics Simulator,” or C, C++, or Python programming, and these methods seem more promising techniques for modeling and simulation of loose abrasive-based machining processes. The other four methods (MVRA, ANN, RSA, and DDS) are experimental and based on statistical approaches that can be used for mathematical modeling of loose abrasive-based machining processes. Additionally, it suggests areas for further investigation and offers a priceless bibliography of earlier studies on the modeling and simulation techniques for abrasive-based machining processes. Researchers studying mathematical modeling of various micro- and nanofinishing techniques for different applications may find this review article to be of great help.

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“…Monocrystalline Silicon is an important structural and optical material [1] and is broadly used in micro/nanoelectromechanical systems [2]. It has a typically fragile behavior at room temperature and atmospheric pressure [3]. This brittle response may be partially reverted to ductile when the deformation process reaches a transition pressure value related to phase transformation hindering the manifestation of deleterious microcrack propagation into the surface and subsurface of the semiconductors crystal [4,5].…”

Section: Introductionmentioning

confidence: 99%

Mapping ductile-to-fragile transition and the effect of tool nose radius in diamond turning of single-crystal silicon

Dib

Otoboni

Jasinevicius

2022

Int J Adv Manuf Technol

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Although it has long been known that tools with more negative rake angles allow the ductile regime to be achieved when machining monocrystalline silicon; little has been discussed about the tool-material interaction in terms of the microgeometric contact of the tool tip at this interface. In this paper, the tool rake angle was varied in order to change the undeformed chip thickness value once the tool cutting radius, formed in front of the tool rake face, changes when the tool rake angle becomes more negative. Based on the statistical design of the experiment applied to cutting tests, a map relating values of transition pressure and different crystallographic directions is built to assist in determining machining conditions with a ductile response within a wider spectrum based on tool rake angle under different machining conditions. The results obtained allowed to answer questions under which machining conditions and tool geometry account for better surface finishes, lower machining forces, and lower residual stresses. The response surfaces generated provided answers capable of establishing under which cutting radii yielded more ductile mode material removal and avoided a brittle response, related to anisotropic response due to change in the crystallographic direction. Finally, we used the brittle-to-ductile transition map to determine a more suitable machining condition to diamond turn Fresnel lenses in single crystal silicon.

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Molecular Dynamics Modeling of Nanoscale Machining of Silicon

Cited by 16 publications

References 8 publications

Estimation of Minimum Uncut Chip Thickness during Precision and Micro-Machining Processes of Various Materials—A Critical Review

Estimation of Minimum Uncut Chip Thickness during Precision and Micro-Machining Processes of Various Materials—A Critical Review

Understanding the Mechanism of Abrasive-Based Finishing Processes Using Mathematical Modeling and Numerical Simulation

Mapping ductile-to-fragile transition and the effect of tool nose radius in diamond turning of single-crystal silicon

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