Molecular dynamics simulation of Cu cluster deposition on Au(001) surfaces

The soft deposition of Cu clusters with Wulff-shape on an Au(001) surface is studied by constanttemperature molecular dynamics. The influence of the kinetic energy, the substrate, the temperature and the cluster orientation is analyzed. Bombardment energy ranges between 1 and 100 meV/atom. At low energy the deposition is mainly elastic, while at higher it is plastic. Randomly rotated clusters suffer a less violent collision. Only in some aligned clusters, epitaxia is found. In the rest of systems, the [00 1] axis of the cluster is at an angle of 45° to the same axis of the substrate. The temperature modifies the horizontal planes such that the Cu main grain matches to the substrate surface. The number of grains is larger in the aligned systems at low temperature.

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Structural resilience of Cu nanoclusters deposited softly on an Au(001) surface

Jiménez-Sáez

Pérez-Martı́n

Jiménez-Rodrı́guez

2006

Physica Status Solidi (a)

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The effect of deposition velocity and cluster size on thin film growth by Cu cluster deposition

Gong

Lü

et al. 2012

Computational Materials Science

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Behavior of Cu and Ni clusters landing at grazing incidence on Ni(001) and Cu(001) surfaces: Molecular dynamics simulation

Kherbouche

Annou

2015

Computational Materials Science

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Molecular dynamics simulation of Cu cluster deposition on Au(001) surfaces

Cited by 10 publications

References 14 publications

Structural resilience of Cu nanoclusters deposited softly on an Au(001) surface

Structural resilience of Cu nanoclusters deposited softly on an Au(001) surface

The effect of deposition velocity and cluster size on thin film growth by Cu cluster deposition

Behavior of Cu and Ni clusters landing at grazing incidence on Ni(001) and Cu(001) surfaces: Molecular dynamics simulation

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