Molecular dynamics simulation of effect of indenter shape on nanoscratch of Ni

Gao, Yuan; Lü, Cheng; Huynh, Nam N; Michal, Guillaume; Zhu, Hong Tao; Tieu, Anh Kiet

doi:10.1016/j.wear.2009.06.024

Cited by 53 publications

(35 citation statements)

References 18 publications

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“…Before scratch, another 50 ps relaxation is applied (Longer relaxation time (100 ps) is also carried out, it does not change the structure). From our verification tests, we find that the indentation rate does not influence the scratch process.The scratch velocity is taken as 15 m/s, which is relatively slow compared to most of the previous nano-scratch simulations [7,9,10]. The scratch depth is defined as the distance between the lowest atom of the tip and the height of the sample surface after scratch, the depth is taken as 24 Å in all the later simulations.…”

Section: Methodsmentioning

confidence: 99%

“…In order to study ploughing, Szlufarska et al [7,8] proposed an analytical model taking account of ploughing friction for single-asperity contacts, and they considered the effects of both elastic recovery and atomic pileup, but without taking account of the tip tilt effect on friction coefficient. Different from macro-scale friction, friction behavior of nano-scratch is sensitive to the detailed contact geometry: Gao et al [9] investigated the effect of asperity shapes on the wear of nickel thin film by using molecular dynamics (MD) simulations, their results reveal that the sharp surface asperities cause more friction than that of the blunt asperities. Zhu et al [10] gave different results, by studying the effect of indenter shape on the nanometric scratching process of copper, they showed the blunt asperities may result in more friction if the asperities are rather small.…”

Section: Introductionmentioning

confidence: 99%

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Ploughing friction and nanohardness dependent on the tip tilt in nano-scratch test for single crystal gold

刘小明

et al. 2015

Computational Materials Science

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a b s t r a c tDifferent from macro-scale scratch, in nano-scale scratch test, the scratching tip is easily tilted, which may display a considerable change of the friction behavior. The ploughing friction and nanohardness dependent on the tip tilt in nano-scratch test for single crystal gold is studied in this paper by using molecular dynamics simulations. The results show that tilting forward (backward) to the scratch direction has a larger effect on the friction coefficient than the case of tilting laterally to the scratch direction. Scratch hardness is also sensitive to the tip tilting forward (backward), while it is insensitive to the tip tilting laterally. Moreover, the local plastic behaviors near tip (pile-up, plastic area, and dislocation evolution) are also dependent on the tip tilt, which may be a major contribution to the mechanism of the nano-scale wear.

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Section: Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Ploughing friction and nanohardness dependent on the tip tilt in nano-scratch test for single crystal gold

刘小明

et al. 2015

Computational Materials Science

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“…The main differences between Mulliah et al's [31,32] results and our results are that we obtained ultra-low friction at a depth of 5 Å in some cases without taking into account the adhesive force. Gao et al [33] studied the effect of indenter shape on the nanoscratch behavior of Ni, obtaining a friction coefficient ranging from 0.31 to 0.43 for a round triangular tip at the scratch depth of 25 Å with tip radius of 140 Å . From scratching experiments at nanoscale depth, the result of the friction coefficients for Ni film given by Islam et al [34] ranged from 0.4084 to 0.4473, which is quite similar to the value obtained in our simulations although the scratch velocity and temperature effect were not taken into account in our cases.…”

Section: Comparison With Other Researchmentioning

confidence: 99%

Nanoscale Friction Behavior of the Ni-Film/Substrate System Under Scratching Using MD Simulation

Liu

Wei

2012

Tribol Lett

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The friction behavior of the nanoscratching process is investigated using molecular dynamic simulations by considering a sphere indenter sliding against a nickel nanofilm structure. In the film/substrate system, the interface-dominated friction process is studied during the nanoscratch process. The results indicate that the interface accommodates deformation during the scratch by absorbing plastic deformation (such as stacking faults and partial dislocations) and by allowing locally interface slip. The observed local material shuffling beneath the tip that was strongly affected by the interface and friction mechanisms, including material ploughing along the track, filling in of the track, and piling up of the chip in front of the tip, are discussed. The combination effects of both scratching depths and film thicknesses were also investigated.

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“…Numerous studies have been reported on MD simulations of nanoindentaion and nanoscratching. The effects of several parameters such as crystal orientation [41,45,46], indenter shape and orientation [33,39,40,44], penetration or scratching depth [37,42,47,48], scratching speed [47,48], feed (on nanoscratching) [34,35], and temperature [25,45,49] have been investigated on different types of bulk and thin film materials. In addition, mechanical properties including Young's modulus, friction coefficient and hardness of materials have also been reported [26,42].…”

Section: Introductionmentioning

confidence: 99%

“…The selection of the potential function depends on material type. Various types were investigated in MD simulations: silicon [22,30,31], gold [32], copper [25,[33][34][35], aluminum [36][37][38], silver [39,40], iron [41,42] and nickel [43,44]. However, MD simulation involves the interaction of a large number of atoms as deformation occurs on an atomic scale.…”

Section: Introductionmentioning

confidence: 99%

Computer Science & Information Technology ( CS & IT )

2014

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) were collocated with the SAI-2014. The conferences attracted many local and international delegates, presenting a balanced mixture of intellect from the East and from the West.The goal of this conference series is to bring together researchers and practitioners from academia and industry to focus on understanding computer science and information technology and to establish new collaborations in these areas. Authors are invited to contribute to the conference by submitting articles that illustrate research results, projects, survey work and industrial experiences describing significant advances in all areas of computer science and information technology.The SAI-2014, CDKP-2014, ICAITA-2014, NeCoM-2014, SEAS-2014, CMCA-2014, ASUC-2014, Signal 2014 Committees rigorously invited submissions for many months from researchers, scientists, engineers, students and practitioners related to the relevant themes and tracks of the workshop. This effort guaranteed submissions from an unparalleled number of internationally recognized top-level researchers. All the submissions underwent a strenuous peer review process which comprised expert reviewers. These reviewers were selected from a talented pool of Technical Committee members and external reviewers on the basis of their expertise. The papers were then reviewed based on their contributions, technical content, originality and clarity. The entire process, which includes the submission, review and acceptance processes, was done electronically. All these efforts undertaken by the Organizing and Technical Committees led to an exciting, rich and a high quality technical conference program, which featured high-impact presentations for all attendees to enjoy, appreciate and expand their expertise in the latest developments in computer network and communications research.In closing, SAI-2014, CDKP-2014, ICAITA-2014, NeCoM-2014, SEAS-2014, CMCA-2014, ASUC-2014, Signal 2014 brought together researchers, scientists, engineers, students and practitioners to exchange and share their experiences, new ideas and research results in all aspects of the main workshop themes and tracks, and to discuss the practical challenges encountered and the solutions adopted. The book is organized as a collection of papers from the SAI-2014, CDKP-2014, ICAITA-2014, NeCoM-2014, SEAS-2014, CMCA-2014, ASUC-2014, Signal 2014 We would like to thank the General and Program Chairs, organization staff, the members of the Technical Program Committees and external reviewers for their excellent and tireless work. We sincerely wish that all attendees benefited scientifically from the conference and wish them every success in their research. It is the humble wish of the conference organizers that the professional dialogue among the researchers, scientists, engineers, students and educators continues beyond the event and that the friendships and collaborations forged will linger and prosper for many years to come.

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Molecular dynamics simulation of effect of indenter shape on nanoscratch of Ni

Cited by 53 publications

References 18 publications

Ploughing friction and nanohardness dependent on the tip tilt in nano-scratch test for single crystal gold

Ploughing friction and nanohardness dependent on the tip tilt in nano-scratch test for single crystal gold

Nanoscale Friction Behavior of the Ni-Film/Substrate System Under Scratching Using MD Simulation

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