Molecular dynamics simulation of stress distribution and microstructure evolution ahead of a growing crack in single crystal nickel

Wu, Weimin; Yao, Zong-Zhuan

doi:10.1016/j.tafmec.2013.01.008

Cited by 73 publications

(21 citation statements)

References 25 publications

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“…To investigate the deformation mechanism, snapshots of the atomic configuration corresponding to various displacement levels are presented in Figure 6, from which it can be observed that the Ni nanoplate deforms elastically. The crack surfaces are clean and flat, indicating that the edge crack propagates in a brittle manner, consistent with previous results [16,18]. previous works to describe the crack propagation process [36,37].…”

Section: Tensile Stress-displacement Curves Of the Ni Nanoplatessupporting

confidence: 91%

“…Impurity point defects influence the critical load for crack initiation in Ni, Cu, and Au single crystals and the change resulting from point defects depends on defect species, geometry, and position [17]. The stress distribution in a single crystal Ni is affected by the microstructure evolution ahead of the crack tip [18]. Fracture behaviors and the critical strain energy release rate for crack propagation of Cu single crystals are dependent on crack length [19].…”

Section: Introductionmentioning

confidence: 99%

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R-curve Evaluation of Copper and Nickel Single Crystals Using Atomistic Simulations

2018

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The technique of molecular statics (MS) simulation was employed to determine the crack growth resistance curve of Cu and Ni single crystals. Copper and Ni single crystal nanoplates with an edge crack subjected to a tensile displacement were simulated. Stress-displacement curves and snapshots of the atomic configuration corresponding to different displacement levels were presented to elucidate the deformation mechanism. It was observed that the edge crack propagated step by step in a brittle manner, and the amount of crack growth at each step was half the lattice parameter. Through an energy consideration, the critical strain energy release rate at the onset of crack propagation and the crack growth resistance were calculated. The crack growth resistance is larger than the critical strain energy release rate because of the crack growth effect.

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Section: Tensile Stress-displacement Curves Of the Ni Nanoplatessupporting

confidence: 91%

Section: Introductionmentioning

confidence: 99%

R-curve Evaluation of Copper and Nickel Single Crystals Using Atomistic Simulations

2018

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“…Considerable attention has been focused on the investigation of the fatigue crack growth behavior in single crystals under cyclic loading using molecular dynamics (MD), which is an effective tool for analyzing the mechanical deformation and mechanical properties of materials at the microscopic scale [1–13]. For face-centered cubic (FCC) metallic systems, Wu et al [10] have investigated the fatigue crack growth in single-crystal Ni under different cyclic loading regimes.…”

Section: Introductionmentioning

confidence: 99%

Fatigue crack growth characteristics of Fe and Ni under cyclic loading using a quasi-continuum method

Qiu¹,

Lin²,

Fang³

2018

Beilstein J. Nanotechnol.

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A quasi-continuum (QC) method based on the embedded atom method (EAM) potential was employed to investigate the fatigue crack growth and expansion characteristics of single-crystal Fe and Ni under cyclic loading modes I and II. In particular, the crack growth and expansion characteristics of Fe and Ni under cyclic loading were evaluated in terms of atomic stress fields and force–distance curves. The simulation results indicated that under cyclic loading, the initially damaged area of the crack will coalesce again after compression or shear to the initial geometry leading to a strengthening of the material. If no coalescence appears, the crack spreads rapidly and the material breaks. Moreover, under the cyclic loading of shear at any orientation, the slip dislocation observed in the materials considerably affects the release of stress.

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“…This advantage to make microscopic simulation (molecular dynamics simulation) in materials science research is very attractive (M. Maki-Jaskari et al, 2000;W.P. WU & Z.Z.…”

Section: Introductionmentioning

confidence: 99%

Random Distribution Voids Evolution Behavior of Porous Aluminum

Zhou¹,

Liu²,

Xu³

2017

dtmse

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For the study of random distribution voids, the size of the voids and the voids evolution behavior rules and system is closely relative to the time been. Explore the general rule in the evolution of voids in the model system with a certain number of random distribution voids: When part of the model system voids near the action point, at the same time, the smaller the void spacing, the void between attachment and force direction Angle 45 °, which is formed by the straight line, so this part of the voids will first evolved together and thus caused enormous damage to the model system.

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Molecular dynamics simulation of stress distribution and microstructure evolution ahead of a growing crack in single crystal nickel

Cited by 73 publications

References 25 publications

R-curve Evaluation of Copper and Nickel Single Crystals Using Atomistic Simulations

R-curve Evaluation of Copper and Nickel Single Crystals Using Atomistic Simulations

Fatigue crack growth characteristics of Fe and Ni under cyclic loading using a quasi-continuum method

Random Distribution Voids Evolution Behavior of Porous Aluminum

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