Molecular dynamics simulation study of thermodynamic and mechanical properties of the Cu–Pd random alloy

Davoodi, Jamal; Ahmadi, Maryam; Rafii-Tabar, Hashem

doi:10.1016/j.msea.2010.03.004

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Calculations Based On the Particle Heating-meltingevaporation Model1

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Cited by 8 publications

(2 citation statements)

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“…52 , the molar heat capacity, C p , was calculated from the data of ref. 36 using the same method as for the refraction index and the enthalpy of fusion was taken from ref. 53 .…”

Section: Methodsmentioning

confidence: 99%

“…36 using the same method as for the refraction index and the enthalpy of fusion was taken from ref. 53. The energies required for transferring the particles from room temperature to the different phases were calculated from the thermodynamic data and divided by the calculated absorption cross-sections to obtain the required laser uences.…”

Section: Calculations Based On the Particle Heating-meltingevaporation Modelmentioning

confidence: 99%

See 1 more Smart Citation

Alloying copper and palladium nanoparticles by pulsed laser irradiation of colloids suspended in ethanol

Gal¹,

Monsa

Ezersky

et al. 2018

RSC Adv.

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“…52 , the molar heat capacity, C p , was calculated from the data of ref. 36 using the same method as for the refraction index and the enthalpy of fusion was taken from ref. 53 .…”

Section: Methodsmentioning

confidence: 99%

Section: Calculations Based On the Particle Heating-meltingevaporation Modelmentioning

confidence: 99%

Alloying copper and palladium nanoparticles by pulsed laser irradiation of colloids suspended in ethanol

Gal¹,

Monsa

Ezersky

et al. 2018

RSC Adv.

View full text Add to dashboard Cite

show abstract

Molecular dynamics study on the tensile deformation of cross-linking epoxy resin

Dong

Han

2015

J Mol Model

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Various epoxy resins are used in the electronic industry as encapsulants, adhesive, printed wiring boards, electronic packagings, and so on. In this study, molecular dynamics method is employed to simulate the tensile deformation of the typical electronic epoxy resin. An efficient cross-linking procedure is developed to build the molecular model. Based on the cross-linking algorithm, the effects of moisture content, cross-linking conversion, strain rate, and temperature on the mechanical properties of epoxy resins are investigated. The stress-strain curves are plotted. Also the Young's modulus and Poisson ratio are calculated. The simulation results are compared with existing experimental data. Good agreements are observed. The results show that mechanical properties of epoxy resin decrease obviously with increasing moisture content and temperature. However the high cross-linking conversion and strain rate enhance the mechanical properties of resin. This study is significant to understanding the mechanical properties of cross-linking epoxies in high temperature and high humidity.

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Growth of CuPd nanoalloys encapsulated in carbon-shell

Kang

Wang

2013

J Nanopart Res

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Molecular dynamics simulation study of thermodynamic and mechanical properties of the Cu–Pd random alloy

Cited by 8 publications

References 9 publications

Alloying copper and palladium nanoparticles by pulsed laser irradiation of colloids suspended in ethanol

Alloying copper and palladium nanoparticles by pulsed laser irradiation of colloids suspended in ethanol

Molecular dynamics study on the tensile deformation of cross-linking epoxy resin

Growth of CuPd nanoalloys encapsulated in carbon-shell

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