“…At a microscopic scale, comparing to a reactive sintering, the intermediate milling step of the UMACS process allows the removal of several microstructural defects generated during solid solution formation. Indeed, the limitations of U 1Àx Am x O 2±d reactive sintering are presumably mainly due to the Kirkendall effect [20][21][22][23], since the rare data available on Am +III interdiffusion in U 0.8 Am 0.2 O 1.9 [24] or in UO 2 [25] and on self-diffusion of U in UO 2 and UO 2+d [26][27][28][29][30][31] suggest quite different diffusion kinetics within and between the two oxides. As a result, anchored closed porosity is created by the Kirkendall effect during the first thermal treatment and is eliminated by the grinding step.…”