Molecular dynamics study on the coalescence of Cu nanoparticles and their deposition on the Cu substrate

Abstract

Molecular dynamics (MD) simulation was conducted to investigate the coalescence of Cu nanoparticles and their deposition on a Cu substrate at various temperatures from 400 K to 1,000 K using the embedded atom method (EAM). The x-z plane projection, spreading index, coalescence index, and pair-correlation distribution were analyzed to gain more insight into the sintering process. Simulation results showed that even at a low temperature of 400 K, metal spheres can be collapsed and deposited on the substrate. Yet higher temperatures were helpful in enhancing the degree of collapsing and deposition.

Thermal behavior of silver nanoparticles for low-temperature interconnect applications

“…This novel approach was applied by Dr. Wong's group in electronic and optopackaging areas to replace high-temperature soldering materials, such as Sn-based alloys, with nanomaterials. 8,9 In this paper, thermal behavior of Ag nanoparticles with respect to the sintering reaction is discussed. Surface changes of the particles during sintering and crystal structure variation are addressed as well.…”

Advanced Molecular Dynamics Simulations on the Formation of Transition Metal Nanoparticles

“…There are many possible force fields (a.k.a. PESs) (Mazzone 2000;Hendy et al 2003) but two used most often are the embedded atom method (Daw & Baskes 1984;Zhao et al 2001;Dong et al 2004;Lummen & Kraska 2004;Lummen & Kraska 2005;Lummen & Kraska 2005a, 2005b, 2005cRozas & Kraska 2007) and the Sutton-Chen potential (Kim et al 2007;Pawluk & Wang 2007;Yukna & Wang 2007;Hudson et al 2010;Kayhani et al 2010). …”

Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization

“…1c). In order to improve the electrical properties of the nanocomposite, sintering nanoparticles in the polymer have been proposed and the sintering behavior of the nanoparticles was reported: 11,12 R total ϭ R btw fillers ϩ R filler to bond pad ϩ R fillers (1) There are still challenges to fabricate the nanocomposites, one of which is the dispersion of the fillers in the polymer matrix. This is due to their large surface area which increases the viscosity of the formulation dramatically.…”