2002
DOI: 10.1016/s0040-6090(02)00316-4
|View full text |Cite
|
Sign up to set email alerts
|

Monitoring epiready semiconductor wafers

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

2
18
0

Year Published

2004
2004
2015
2015

Publication Types

Select...
7

Relationship

0
7

Authors

Journals

citations
Cited by 29 publications
(20 citation statements)
references
References 19 publications
2
18
0
Order By: Relevance
“…On the other hand, regardless of the age of the epi-ready preparation, substantial improvement of the substrate morphology after the oxide desorption was obtained by employing the two-stage process, with the partial oxide removal by exposure to Ga flux at temperatures below 500°C. The experiments performed on the oldest epi-ready wafers used in the present study, which were stored for four years in an opened cassette rather than a sealed nitrogen filled bag, showed a still considerable, albeit smaller benefit of the partial oxide removal with Ga exposure, indicating that the corrosion of the GaAs by Ga 2 O 3 has already started during wafer storage, consistent with reports by Allwood et al 5 Nevertheless, a removal of about 80% of the oxide during the Ga exposure stage from these wafers resulted in the rms roughness of 0.57 nm and ⌬ max of Ϫ7.8 nm, which is by a factor of 2 better than for standard oxide desorption from the fresh epi-ready substrate.…”
Section: Resultssupporting
confidence: 91%
See 1 more Smart Citation
“…On the other hand, regardless of the age of the epi-ready preparation, substantial improvement of the substrate morphology after the oxide desorption was obtained by employing the two-stage process, with the partial oxide removal by exposure to Ga flux at temperatures below 500°C. The experiments performed on the oldest epi-ready wafers used in the present study, which were stored for four years in an opened cassette rather than a sealed nitrogen filled bag, showed a still considerable, albeit smaller benefit of the partial oxide removal with Ga exposure, indicating that the corrosion of the GaAs by Ga 2 O 3 has already started during wafer storage, consistent with reports by Allwood et al 5 Nevertheless, a removal of about 80% of the oxide during the Ga exposure stage from these wafers resulted in the rms roughness of 0.57 nm and ⌬ max of Ϫ7.8 nm, which is by a factor of 2 better than for standard oxide desorption from the fresh epi-ready substrate.…”
Section: Resultssupporting
confidence: 91%
“…Although a combination of smoothing superlattices and thick GaAs buffer layers can effectively planarize the surface, their deposition takes time, consumes elements, and could be undesirable for a variety of other reasons. Research done on the aging mechanisms of ''epi-ready'' GaAs ͑001͒ wafer surfaces 4,5 suggests that the longer time elapsed since the epi-ready surface preparation, the rougher the GaAs substrate surface is after the oxide removal. This has been attributed to a spatially inhomogeneous bulk reaction between the GaAs surface and the arsenic oxide: 2GaAsϩAs 2 O 3 →4As ϩGa 2 O 3 .…”
Section: Introductionmentioning
confidence: 99%
“…Surface roughness and impurity contamination have been correlated with poor surface morphology, interfacial carrier accumulation (or depletion), and interface states, all of which negatively impact material quality and device performance [1][2][3][4][5][6]. While the use of epiready GaAs and InP substrates may be considered more routine [7], epiready GaSb substrates had a rougher surface morphology after thermal desorption of the oxide layer compared to ones that had been first prepared by chemically etching in HCl and then thermally cleaned [6]. The increased roughness was attributed to a thicker oxide layer on the epiready surface.…”
Section: Introductionmentioning
confidence: 99%
“…After that point, RHEED pattern has shown no pattern and intensity changes. First RHEED spot intensity increase is related with the As 2 O 3 , As 2 O 5 and Ga 2 O desorption from the surface while the second one is related to more tightly bonded Ga 2 O 3 desorption from the GaAs surface [10].…”
Section: Contributedmentioning
confidence: 96%