complementarymetal-oxide-semiconductor (CMOS) processing limits the practical realization of these long-sought-after PICs. [2] Germanium (Ge) has been extensively explored for such a laser owing to its CMOS compatibility and near-direct bandgap configuration. [3,4] Among various approaches to achieve the bandgap directness, strain engineering [5][6][7][8][9][10][11][12][13] and tin (Sn) alloying [14][15][16][17] have been considered as the two most promising paradigms.While lasing action has been observed in strain-engineered Ge at low operating temperatures (<100 K), [18][19][20] the Sn alloying approach has made significant, steady progress toward achieving lasing at practically high temperature over the past few years. [21][22][23][24][25][26][27] Since the first lasing demonstration in GeSn at 90 K, [21] much effort has been focused on increasing the operating temperature. [21][22][23][24][25][26][27] A major route to this end has been to increase the Sn content to further increase the directness of GeSn alloys, [17] which enabled higher operating temperatures reaching 270 K. [27] However, the lasing thresholds at these elevated temperatures are very high (>800 kW cm −2 at 270 K). [27] The exact causes for such high threshold in direct bandgap GeSn lasers have been attributed to the material quality. [17] For instance, it has been suggested that a large content of Sn increases the nonradiative recombination rate, thus leading to the reduction of internal quantum efficiency which influences the lasing threshold significantly. [17] In addition, the Sn alloying is typically accompanied by the compressive strain in the GeSn layer due to the large lattice mismatch between GeSn and Ge buffer layers. [15] Such compressive strain reduces the directness of GeSn, [28,29] thereby hindering the lasing performance. [30] Additionally, the increase in Sn content requires a decrease in growth temperature, which is typically associated with a higher concentration of point defects (vacancies and vacancies complexes) that can also impact the laser performance due to carrier trapping. [31,32] Another route to improve the lasing performance is to simultaneously employ both strain engineering and Sn alloying. [28,33] Recently, a few research groups have made significant progress along this direction by relaxing the compressive strain [22,34] and also by inducing mechanical tensile strain in GeSn. [35,36] Despite the improved directness of strain-engineered GeSn over as-grown compressively strained GeSn, the suspended device configuration, which has thus far been necessary for GeSn alloys are promising candidates for complementary metal-oxidesemiconductor-compatible, tunable lasers. Relaxation of residual compressive strain in epitaxial GeSn has recently shown promise in improving the lasing performance. However, the suspended device configuration that is thus far introduced to relax the strain is destined to limit heat dissipation, thus hindering the device performance. Herein is demonstrated that strain-free GeSn microdisk laser ...