Monolithic Integrated Schottky Diode Multiplier and Rectenna for Wireless Communication Link in the W Band

Abstract

A W band (75 -110 GHz) communication link using monolithic integrated single-diode circuits is proposed. The circuits are based on GaAs Schottky diodes with cutoff frequencies around 1.5 THz integrated with on chip folded slot antennas and near-field 3D printed dielectric lenses. The total chip area is 1.4 × 3.5 mm 2 . The receiver module shows a peak isotropic voltage sensitivity of 12260 mV/mW at 94 GHz, with a noise equivalent power of 12 pW/√𝐻𝑧. These results include the slot antenna and a 3 mm radius 3D printed lens. The transmitter acts as a free-space W band signal generator using the non-linear properties of the diode for frequency multiplication. Multiplication orders up to ×15 are tested for input powers of 10 mW. The generated power is measured by a horn antenna placed at a distance of 100 mm from the transmitter and a 2D map for the frequency range 90 -100 GHz and multiplication orders between ×2…×15 is presented. The two circuits are used to demonstrate W band communication links using 1 kHz amplitude modulated input signals with carriers at 6 GHz, X band and in the Ku band. Voltages of hundreds of mV are detected for a distance of 150 mm between transmitter and receiver circuits and tens of mV at 600 mm. The proposed approach can be used as a low cost and low complexity alternative for point-to-point high-speed wireless communications.

Enhanced Monopole Antenna for On-Chip E-Band Applications

“…In other works, external resonator substrates placed in the vicinity of the antenna [14] or lenses [15,16] have been used. Other alternatives are 1) micromachining, which consists of the removal of small amounts of silicon under or in the vicinity of the radiating device [17]; 2) local doping around the antenna [18]; 3) optimization of the position so that the antenna has fewer devices nearby to avoid coupling, interference, and other parasitic effects [19]; 4) metallization of printed circuit board cards so that they act as reflectors [20]; and 5) the use of high-resistivity semiconductor substrates [21] to reduce losses due to the substrate.…”