Monolithic RF MEMS Switch Matrix Integration

Daneshmand, Mojgan; Mansour, Raafat R.

doi:10.1109/mwsym.2006.249414

Cited by 33 publications

(5 citation statements)

References 3 publications

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“…Using these designs, a set of MEMS capacitive switches have been fabricated. The MEMS switches are based on a 5-mask batch process developed at the University of Waterloo and built in CIRFE labs [6]. In Fig.…”

Section: Switch Designmentioning

confidence: 99%

A Novel Warped-Beam Design that Enhances RF Performance of Capacitive MEMS Switches

Al-Dahleh

Mansour

2007

2007 IEEE/MTT-S International Microwave Symposium

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This paper presents the design, fabrication and testing of a novel electrostatically actuated capacitive shunt switch for X-band applications. By introducing warped bimetallic beams within the switch's geometry, the effective capacitive area is optimized to fine-tune the switch's RF performance in the 'off' state without influencing the switch's 'on' state performance. As a result, measurements show a drastic improvement where the down-state capacitance is doubled and the up-state capacitance is halved. Using this technique, a dualwarped switch with an off-to-on capacitive ratio of almost 170 is achieved without the need for thin dielectrics or high dielectric constant materials, exhibiting excellent RF performance and mechanical reliability.

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Section: Switch Designmentioning

confidence: 99%

A Novel Warped-Beam Design that Enhances RF Performance of Capacitive MEMS Switches

Al-Dahleh

Mansour

2007

2007 IEEE/MTT-S International Microwave Symposium

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“…Scaling to a higher number of cross-points could be done with another interesting technology presented by Daneshmand et al, introducing RF switch matrices for satellite payload systems [19]. They developed a single-pole three-throw (SP3T) switch and integrated it with an interconnect network, providing a monolithic 3 × 3 RF switch matrix [12]. This work is an optimization of a previous work presented by Yassini et al [13], which introduces a hybrid integration of a LTCC-based interconnect network with a single-pole four-throw (SP4T) MEMS switch.…”

Section: Previous Switch Units and Mems Switch Arraysmentioning

confidence: 99%

Single-chip MEMS 5 × 5 and 20 × 20 double-pole single-throw switch arrays for automating telecommunication networks

Braun¹,

Oberhammer²,

Stemme³

2007

J. Micromech. Microeng.

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This paper reports on microelectromechanical (MEMS) switch arrays with 5 × 5 and 20 × 20 double-pole single-throw (DPST) switches embedded and packaged on a single chip, which are intended for automating main distribution frames in copper-wire telecommunication networks. Whenever a customer requests a change in his telecommunication services, the copper-wire network has to be reconfigured which is currently done manually by a costly physical re-routing of the connections in the main distribution frames. To reduce the costs, new methods for automating the network reconfiguration are sought after by the network providers. The presented devices comprise 5 × 5 or 20 × 20 double switches, which allow us to interconnect any of the 5 or 20 input lines to any of the 5 or 20 output lines. The switches are based on an electrostatic S-shaped film actuator with the switch contact on a flexible membrane, moving between a top and a bottom electrode. The devices are fabricated in two parts which are designed to be assembled using selective adhesive wafer bonding, resulting in a wafer-scale package of the switch array. The on-chip routing network consists of thick metal lines for low resistance and is embedded in bencocyclobutene (BCB) polymer layers. The packaged 5 × 5 switch arrays have a size of 6.7 × 6.4 mm 2 and the 20 × 20 arrays are 14 × 10 mm 2 large. The switch actuation voltages for closing/opening the switches averaged over an array were measured to be 21.2 V/15.3 V for the 5 × 5 array and 93.2 V/37.3 V for the 20 × 20 array, respectively. The total signal line resistances vary depending on the switch position within the array between 0.13 and 0.56 for the 5 × 5 array and between 0.08 to 2.33 for the 20 × 20 array, respectively. The average resistance of the switch contacts was determined to be 0.22 with a standard deviation of 0.05 .

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“…The research on switch matrix topology has a relatively long history, some conventional architectures are Benes networks [3, 4], Clos networks [5], crossbar networks [6] and so on. These topologies are massively applied to optical or digital signal switch matrices.…”

Section: Introductionmentioning

confidence: 99%

SR‐Crossbar topology for large‐scale RF MEMS switch matrices

Zhou

Sheng

Cui

et al. 2019

IET Microwaves, Antennas & Propagation

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With the development of multifunctional satellites, the integration and multiplexing of satellite resources become increasingly important. Large-scale radio-frequency microelectromechanical system (RF MEMS) switch matrix technology is one of the key technologies to design a multifunctional satellite. This study proposed a novel sequential rotation crossbar (SR-Crossbar) topology for large-scale RF MEMS switch matrices. A specifically designed novel configuration scheme or arraying method for SR-Crossbar topology is also proposed. The number of switch elements in the SR-Crossbar RF MEMS switch matrix is significantly reduced; hence, the reliability and performance of the matrix can be improved simultaneously. For an N × N RF MEMS switch matrix, in a fully configured scenario, the maximum number of switch elements in all the paths are N(N + 1)/2. When N ≥ 4, the proposed SR-Crossbar RF MEMS switch matrix topology is better than the planar Benes topology, which is already an optimised planar switch matrix topology with the minimum number of nodes.

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Monolithic RF MEMS Switch Matrix Integration

Cited by 33 publications

References 3 publications

A Novel Warped-Beam Design that Enhances RF Performance of Capacitive MEMS Switches

A Novel Warped-Beam Design that Enhances RF Performance of Capacitive MEMS Switches

Single-chip MEMS 5 × 5 and 20 × 20 double-pole single-throw switch arrays for automating telecommunication networks

SR‐Crossbar topology for large‐scale RF MEMS switch matrices

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