2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) 2017
DOI: 10.1109/transducers.2017.7994454
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Monolithic silicon-on-nothing photonic crystal pressure sensor

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Cited by 10 publications
(8 citation statements)
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“…Figure 2 shows how under-etching and selective removal of passivation layers can extend the design space by de-coupling the diaphragm and void thickness. The process (GSON) is a combination of the GOPhER process [10] and ESS/SON [11].…”
Section: Gson Processmentioning
confidence: 99%
See 1 more Smart Citation
“…Figure 2 shows how under-etching and selective removal of passivation layers can extend the design space by de-coupling the diaphragm and void thickness. The process (GSON) is a combination of the GOPhER process [10] and ESS/SON [11].…”
Section: Gson Processmentioning
confidence: 99%
“…To demonstrate the capability of GSON to create multiple-layers of MEMS structures, we fabricated absolute pressure sensors with integrated photonic crystal (PC) mirrors, following the process described in Fig. 3 [11]. The macroscopic annealing simulation of this device is shown in Fig.…”
Section: Sensor Design Fabrication and Characterizationmentioning
confidence: 99%
“…A point defect embedded in the PC structure, that acts as a micro-cavity, can trap the light. So far, a few PC-based structures have been suggested for strain/stress [12][13][14][15], and pressure sensor [16][17][18][19][20][21][22][23][24].…”
Section: Introductionmentioning
confidence: 99%
“…In 2016, Tao et al [22] proposed a 2D PC pressure sensor that consists of two PC quasi waveguides and an optimized nanocavity that is placed in between the two quasi waveguides. In 2017, Wong et al [23] realized and simulated (using FEM analysis and also rigorous coupled-wave analysis) a pressure sensor using PC mirror pressure-sensing diaphragms with silicon-on-nothing (SON) reference cavities. In 2021, Mishra et al [24] proposed a 1D indium arsenide (InAs) PC-waveguide-based pressure sensor with respect to the output transmitted intensity in 3-communication windows.…”
Section: Introductionmentioning
confidence: 99%
“…The novel fabrication process enables simple manufacturing of multiscale (micro to nano) cavities without hermetical sealing process. Due to such unique advantages, SON and GON structures are adopted in various applications [8][9][10][11][12][13][14] . These applications are widely sorted into two categories: devices which exploit the cavity itself and others which value its peripherals.…”
Section: Introductionmentioning
confidence: 99%