2021
DOI: 10.35848/1347-4065/ac2b7b
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Morphological control of nanostructured Ge films in high Ar-gas-pressure plasma sputtering process for Li ion batteries

Abstract: We present a study on morphological control of nanostructured Ge films by the Ar gas pressure in plasma sputtering deposition. In the low Ar-gas-pressure range, aggregated islands of amorphous grains are formed on the film surface, while in the high-pressure range of 500 mTorr monodisperse nano-grains of about 30 nm in size are orderly arranged without aggregation. The film porosity shows a high value of over 10%. We tested the charge/discharge cycle performance of Li-ion batteries with nanostructured Ge films… Show more

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Cited by 4 publications
(5 citation statements)
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“…The shorter target-substrate distance leads to the larger amount of highly reactive Ge atoms impinging to the substrate surface, which results in the rapid growth of grains on the substrate and the high deposition rate. On the other hand, at high pressures such as 0.5 Torr, Ge nanoparticles could be synthesized in a gas-phase plasma because a higher-density plasma is produced locally in front of the cathode sputtering target [1], [14]. The shorter collision mean free path for Ge species would cause nucleation of nanograins in the gas phase [12], [15].…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…The shorter target-substrate distance leads to the larger amount of highly reactive Ge atoms impinging to the substrate surface, which results in the rapid growth of grains on the substrate and the high deposition rate. On the other hand, at high pressures such as 0.5 Torr, Ge nanoparticles could be synthesized in a gas-phase plasma because a higher-density plasma is produced locally in front of the cathode sputtering target [1], [14]. The shorter collision mean free path for Ge species would cause nucleation of nanograins in the gas phase [12], [15].…”
Section: Resultsmentioning
confidence: 99%
“…The Ge films were fabricated on an n-type Si wafer and Cu disk using 13.56 MHz radio-frequency (RF) magnetron sputtering, as schematically shown in Fig. 1 [14]. The diameter and thickness of the Cu disk were 15 mm and 80 µm, respectively.…”
Section: Methodsmentioning
confidence: 99%
“…Some of the following explanations of methods overlap with descriptions in our previous papers 68,69 . The Si anode films were fabricated on a Cu disk using 13.56 MHz radiofrequency (rf) magnetron sputtering.…”
Section: Methodsmentioning
confidence: 98%
“…1 in Ref. 34), and the sputtering target was changed from Ge to a GeSn (6 at%) disk 1 inch in diameter in the present study. The rf input power was varied at 3.94 (20 W) and 11.8 W cm −2 (60 W), where the Ar gas pressure was 500 mTorr, the target-substrate distance was 20 mm, and substrate was not heated or cooled.…”
Section: Methodsmentioning
confidence: 99%
“…22,32,33) We have already successfully generated a dispersed arrangement of monodisperse nanograins without aggregation using an Ar high-pressure plasma process in the sub-Torr range. 34,35) In the present study, we used Ar highpressure sputtering to fabricate GeSn nanomaterials for Li + -ion battery anodes.…”
Section: Introductionmentioning
confidence: 99%