2014
DOI: 10.1016/j.spmi.2014.06.007
|View full text |Cite
|
Sign up to set email alerts
|

Morphological stability of Ag reflector for high-power GaN-based vertical light-emitting diode by addition of Ni layer

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

0
11
0

Year Published

2016
2016
2020
2020

Publication Types

Select...
6
1

Relationship

0
7

Authors

Journals

citations
Cited by 8 publications
(11 citation statements)
references
References 31 publications
0
11
0
Order By: Relevance
“…Improving the light extraction efficiency is vital for the development of HB LEDs. One of the methods is to reduce the light scattering by depositing a highly reflective silver (Ag) thin film on the lead frame surface [3][4][5][6][7][8]. The Ag layer also serves the purpose of enhancing the solderability and heat dissipation of the lead frame.…”
Section: Introductionmentioning
confidence: 99%
“…Improving the light extraction efficiency is vital for the development of HB LEDs. One of the methods is to reduce the light scattering by depositing a highly reflective silver (Ag) thin film on the lead frame surface [3][4][5][6][7][8]. The Ag layer also serves the purpose of enhancing the solderability and heat dissipation of the lead frame.…”
Section: Introductionmentioning
confidence: 99%
“…The Ag grain size was increased by EBI. In addition, the diffusion from small Ag grains to large Ag grains decreased due to increased Ag grains by EBI .…”
Section: Resultsmentioning
confidence: 99%
“…The agglomeration usually causes a light scattering phenomenon and decreased conductivity with respect to the initial smooth layer, thus decreasing the specular reflection and conductivity [6][7][8][9][10]. In the past decade, thermal stability or thermal degradation (i.e., agglomeration) of Ag films on GaN-related semiconductors for LEDs have been extensively investigated in many studies [11][12][13][14][15][16][17][18][19][20]. One solution for improving the thermal stability of Ag films was proposed by adopting capping layers like NiZn alloy [11], SnO 2 [12], Zn [13], and IZO [15] on Ag films, or using interlayers like Ni [14] and Ir [15] layers beneath the Ag films, to retard the Ag agglomeration process at high temperature.…”
Section: Introductionmentioning
confidence: 99%
“…One solution for improving the thermal stability of Ag films was proposed by adopting capping layers like NiZn alloy [11], SnO 2 [12], Zn [13], and IZO [15] on Ag films, or using interlayers like Ni [14] and Ir [15] layers beneath the Ag films, to retard the Ag agglomeration process at high temperature. Another solution was forming Ag alloy films by adding several percent of Al [16],…”
Section: Introductionmentioning
confidence: 99%