Morphological study of silver corrosion in highly aggressive sulfur environments

Minzari, Daniel; Jellesen, Morten Stendahl; Møller, Per; Ambat, Rajan

doi:10.1016/j.engfailanal.2011.07.003

Cited by 37 publications

(15 citation statements)

References 19 publications

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“…[28][29][30] In case of multilayered Sn/Ag 3 Sn film, elemental Ag diffuses simultaneously inward toward the film/substrate interface because of its strong migration nature with aging time. 1,9 The inward Ag diffusion may be predominant to the outward Cu diffusion, thus leading to the accumulation of Ag nanoparticles at the film/substrate interface (see Fig. 9e and Fig.…”

Section: Element Diffusion Behaviors In Multilayered Snmentioning

confidence: 99%

“…However, silver sulfide corrosion has been a big concern in various industrial applications, not only in the automotive industry, but also in vehicle exhaust fumes (exit/entrance ramps), rubber manufacturing, sewage/waste-water treatment plants, petroleum refineries, coal-generation power plants, large-scale farms, etc. 9,10 In addition, other disadvantages of pure Ag films included electro-migration and softening because of recrystallization of Ag at temperature above 373 K.…”

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confidence: 99%

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Corrosion Resistance of Multilayered Sn/Ag₃Sn Films Electroplated on Cu Alloys for Highly Reliable Automotive Connectors

Kure‐Chu

Yashiro

2014

J. Electrochem. Soc.

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The corrosion resistance of multilayered Sn/Ag 3 Sn films with a 30-80 nm-thick Ag layer on reflowed Sn layer (i.e., melting and resolidification of the electrodeposited Sn) on Cu alloy substrates was investigated by accelerated sulfidizing tests in (NH 4 ) 2 S x solutions and accelerated aging tests at 473 K, and compared to conventional Ag and reflowed Sn films on Cu alloy. The multilayered Sn/Ag 3 Sn films exhibited stable electrical contact resistance even after immersion in a 0.2 mL/L (NH 4 ) 2 S x solution for 120 h. In contrast, the Ag films showed ever-increasing contact resistance with immersion time and eventually failed by losing their surface electric conductivity. Moreover, the multilayered Sn/Ag 3 Sn films showed low and stable electrical contact resistance equivalent to as-plated samples even after aging at 473 K for 3000 h, whereas the conventional Ag and reflowed Sn films delivered unstable and ever-increasing contact resistances at 500 h. The excellent corrosion resistance of the multilayered Sn/Ag 3 Sn films can be mainly attributed to a thin SnO film on the intermetallic Ag 3 Sn layer, which is chemically stable in the presence of S 2− ions, and the inclusion of Ag component in Cu 6 Sn 5 /Cu 3 Sn phases by inward diffusion, which enhances the oxidation resistance of the Cu-Sn alloy during aging at high temperature.

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Section: Element Diffusion Behaviors In Multilayered Snmentioning

confidence: 99%

mentioning

confidence: 99%

Corrosion Resistance of Multilayered Sn/Ag₃Sn Films Electroplated on Cu Alloys for Highly Reliable Automotive Connectors

Kure‐Chu

Yashiro

2014

J. Electrochem. Soc.

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“…[1][2][3][4] Silver is the most used metal for industrial optical applications. This metal possesses the highest reflectivity, from 400 nm through the IR, and the lowest polarization splitting among all metals.…”

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confidence: 99%

Interpretation of Electrochemical Impedance for Corrosion of a Coated Silver Film in Terms of a Pore-in-Pore Model

Amor

Sutter

Takenouti

et al. 2014

J. Electrochem. Soc.

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Electrochemical impedance spectroscopy was used to study the degradation behavior of thin multilayer stacks; Si 3 N 4 /Ag/Si 3 N 4 . Measurements were carried out in 0.5 M Na 2 SO 4 adjusted at pH 10. The impedance data collected at the open circuit potential were analyzed with a physical model where all elements are clearly defined. The results suggest a constant phase element behavior at the electrolyte dielectric interface assigned to an in-depth distribution of local resistivity through the dielectric layer induced by the electrolyte penetration. To explain the electrochemical behavior of the thin silver layer, a localized corrosion in a delaminated zone between the upper dielectric and the silver layers was adopted. The localized corrosion was found to be related to the granular structure of the silver layer in which pores are formed between the grains of silver. This model is equivalent to a recently developed double porosity or pore-in-pore model.Thin film deposition of metallic, dielectric, and semiconducting materials is widely used in many applications, including microelectronic devices, optical coatings, solar cells, and thin-film batteries. [1][2][3][4] Silver is the most used metal for industrial optical applications. This metal possesses the highest reflectivity, from 400 nm through the IR, and the lowest polarization splitting among all metals. 5 Silver also has the lowest emissivity of all metals in the visible and IR regions. However, in aggressive environments, a silver layer is susceptible to deterioration. This deterioration depends on many factors, such as pH, humidity, temperature, type and concentrations of pollutants, and exposure time. [6][7][8][9][10][11][12][13][14][15] To study the degradation behavior of silver thin films in such environments, different analytical methods are commonly employed. The most commonly used techniques are transmission electron microscopy, atomic force microscopy, and recently time-of-flight secondary ion mass spectrometry. 16,17 These various techniques provide only very local information and often require complex sample preparation. Recently, electrochemical methods, and, more specifically, electrochemical impedance spectroscopy (EIS), have emerged as an alternate way to study material and interface properties of thin film stacks. [18][19][20] The interpretation of EIS results is usually done through the construction of equivalent electric circuits that simulate the system under investigation. This allows the extraction of physical parameters related to the film microstructure that are not easily accessible by other techniques. 21 For instance, Zeng et al. 18 show that EIS can be applied to measure the nano-porosity of diamond-like carbon films deposited on silicon substrates. They used an equivalent circuit that took into account both open and closed pores. Tse Chu et al. 22 showed that dielectric protected silver reflectors can be reasonably described by an equivalent circuit consisting of two constant phase element (CPE) components. They considered only ...

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“…In addition, the resistivity of silver sulfide is 7-10 order of magnitude higher than that of silver [3], so the overall resistivity will continue to increase with the formation of silver sulfide. Silver sulfide also poses a threat to circuits because its dendritic growth nature might result in the formation of silver sulfide whiskers [4]. This could lead to the occurrence of short circuit since silver sulfide is not a good insulating material either.…”

Section: Introductionmentioning

confidence: 99%

A reaction study of sulfur vapor with silver and silver–indium solid solution as a tarnishing test method

Huo

Lee

2016

J Mater Sci: Mater Electron

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Morphological study of silver corrosion in highly aggressive sulfur environments

Cited by 37 publications

References 19 publications

Corrosion Resistance of Multilayered Sn/Ag₃Sn Films Electroplated on Cu Alloys for Highly Reliable Automotive Connectors

Corrosion Resistance of Multilayered Sn/Ag₃Sn Films Electroplated on Cu Alloys for Highly Reliable Automotive Connectors

Interpretation of Electrochemical Impedance for Corrosion of a Coated Silver Film in Terms of a Pore-in-Pore Model

A reaction study of sulfur vapor with silver and silver–indium solid solution as a tarnishing test method

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Morphological study of silver corrosion in highly aggressive sulfur environments

Cited by 37 publications

References 19 publications

Corrosion Resistance of Multilayered Sn/Ag3Sn Films Electroplated on Cu Alloys for Highly Reliable Automotive Connectors

Corrosion Resistance of Multilayered Sn/Ag3Sn Films Electroplated on Cu Alloys for Highly Reliable Automotive Connectors

Interpretation of Electrochemical Impedance for Corrosion of a Coated Silver Film in Terms of a Pore-in-Pore Model

A reaction study of sulfur vapor with silver and silver–indium solid solution as a tarnishing test method

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Corrosion Resistance of Multilayered Sn/Ag₃Sn Films Electroplated on Cu Alloys for Highly Reliable Automotive Connectors

Corrosion Resistance of Multilayered Sn/Ag₃Sn Films Electroplated on Cu Alloys for Highly Reliable Automotive Connectors