Morphologies of copper deposits obtained by the electrodeposition at high overpotentials

Nikolić, Nebojša D.; Popov, Konstantin; Pavlović, Lj.J.; Pavlović, Marko

doi:10.1016/j.surfcoat.2005.12.004

Cited by 184 publications

(110 citation statements)

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“…For well over a century it has been known, however, that the layer deposited during electrodeposition is prone to morphological instabilities, leading to ramified growth of the electrode surface. Over the years, many experimental, theoretical, and numerical studies have been devoted to increasing the understanding of this ramified growth regime [12][13][14][15][16][17][18][19][20]. Big contributions to our understanding of the growth process have come from diffusion-limited aggregation (DLA) models [21,22] and, more recently, phasefield models similar to those that have successfully been applied to solidification problems [23][24][25][26][27][28][29].…”

Section: Introductionmentioning

confidence: 99%

Sharp-interface model of electrodeposition and ramified growth

Nielsen

Bruus

2015

Phys. Rev. E

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We present a sharp-interface model of two-dimensional ramified growth during quasisteady electrodeposition. Our model differs from previous modeling methods in that it includes the important effects of extended spacecharge regions and nonlinear electrode reactions. The electrokinetics is described by a continuum model, but the discrete nature of the ions is taken into account by adding a random noise term to the electrode current. The model is validated by comparing its behavior in the initial stage with the predictions of a linear stability analysis. The main limitations of the model are the restriction to two dimensions and the assumption of quasisteady transport.

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Section: Introductionmentioning

confidence: 99%

Sharp-interface model of electrodeposition and ramified growth

Nielsen

Bruus

2015

Phys. Rev. E

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“…Potentiostatic deposition technique is essentially used to investigate the nucleation and growth process through current-time transient [18]. For instance, at lower applied potentials, anisotropic branched dendrites were obtained in Cu electrodeposition [19]. The extent of branching of these dendrites was increased at higher applied potentials.…”

Section: Introductionmentioning

confidence: 99%

Potentiostatic Electrodeposition of Co-Ni-Fe Alloy Particles Thin Film in a Sulfate Medium

Hanafi¹,

Daud²,

Radiman³

2017

Port. Electrochim. Acta

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The aim of this study was to produce thin films of ternary cobalt-nickel-iron (Co-NiFe) alloy by electrochemical deposition method at different electrodeposition potentials in a sulfate solution (0.15 M CoSO 4 + 0.2 M NiSO 4 + 0.005 M FeSO 4 ). The Co-Ni-Fe alloy thin films were electrodeposited on indium-doped tin oxide (ITO) coated on a conducting glass substrate. Voltammetric studies indicated the potential range between -1.10 to -1.30 V (SCE) for successful deposition of Co, Ni and Fe. The energy dispersive X-ray (EDX) analysis indicated that the films exhibited anomalous behavior with Ni content significantly increased, whereas the Co and Fe content decreased as the electrodeposition potentials reached more negative values. The scanning electron microscopy (SEM) study showed that the electrodeposited films were uniform for all applied potential values and larger particles were formed when higher electrodeposition potentials were applied. Investigation by X-ray diffraction (XRD) revealed that the dominant phase in the deposited film was amorphous Co-Ni-Fe. Hysteresis curves of the ternary alloy film obtained from vibrating sample magnetometer results prove that the alloy is ferromagnetic. The coercivity mechanism of the Co-Ni-Fe films has obeyed Neel's relation which is thickness dependence.

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“…Electrodeposition technique was shown to be very favorable way for the production of this type of electrodes [1,2,4]. Open porous copper electrodes, denoted as both 3-D foam [1,2,4] or honeycomb-like electrodes [5][6][7][8][9][10][11][12][13], are formed by electrodeposition at high current densities and overpotentials, when, parallel to electrodeposition process, the hydrogen evolution reaction occurs. The main characteristics of these electrodes are holes or pores formed upon detachment of hydrogen bubbles, surrounded by the agglomerates of metal grains or dendritic particles.…”

Section: Introductionmentioning

confidence: 99%

“…The specific surface area of these structures is determined by the number and size of the holes, as well as by the width of the walls in-between [4]. Aside from copper, which is the most studied system [1,2,[4][5][6][7][8][9][10][11][12][13][14][15], open porous structures of some other technologically important metals, such as tin [1], nickel [16], silver [17,18], gold [19], lead [20], and copper-tin alloys [2], were also investigated.…”

Section: Introductionmentioning

confidence: 99%