Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals

Zou, Hui; Yang, H.J.; Zhang, Z.F.

doi:10.1016/j.actamat.2008.01.055

Cited by 185 publications

(72 citation statements)

References 22 publications

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“…While faceted prism-type Cu 6 Sn 5 grains aligned along three different directions are formed on a (111) Cu single crystal, and their intersecting angles are approximately equal to 60 , which agrees with Ref. 18. Figure 2 shows the micrographs of the (111)Cu/Sn/Cu microinterconnects after soldering with an additional temperature gradient, the corresponding EBSD inverse pole figure orientation image maps (OIMs), and the inverse pole figures of Cu 6 Sn 5 in RD from the EBSD maps.…”

supporting

confidence: 76%

“…However, the preferred texture of Cu 6 Sn 5 will degrade, and meanwhile, the regular prism-type Cu 6 Sn 5 grains will change into the scallop-type as soldering or aging time is extended. 16,18 The objective of this study is attempting to maintain the regular faceted prism-type g-Cu 6 Sn 5 textures at the liquid-Sn/(111)Cu interfaces by soldering under the temperature gradient.…”

mentioning

confidence: 99%

“…3), and the habit planes of these two phases should be f11 20g g jj {111} Cu Note that the regular faceted prism-type g-Cu 6 Sn 5 grains will change into the scallop-type after prolonged soldering (less than 10 min when Sn/(111)Cu joints are reflowed at 260 C). 18 Moreover, Zhang et al 16 reported that scallop-type Fig. 2(b4).…”

mentioning

confidence: 99%

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Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111)Cu interface under temperature gradient

Zhong

Zhao

Liu

et al. 2017

Applied Physics Letters

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As the diameter of solder interconnects in three-dimensional integrated circuits (3D ICs) downsizes to several microns, how to achieve a uniform microstructure with thousands of interconnects on stacking chips becomes a critical issue in 3D IC manufacturing. We report a promising way for fabricating fully intermetallic interconnects with a regular grain morphology and a strong texture feature by soldering single crystal (111) Cu/Sn/polycrystalline Cu interconnects under the temperature gradient. Continuous epitaxial growth of η-Cu6Sn5 at cold end liquid-Sn/(111)Cu interfaces has been demonstrated. The resultant η-Cu6Sn5 grains show faceted prism textures with an intersecting angle of 60° and highly preferred orientation with their ⟨112¯0⟩ directions nearly paralleling to the direction of the temperature gradient. These desirable textures are maintained even after soldering for 120 min. The results pave the way for controlling the morphology and orientation of interfacial intermetallics in 3D packaging technologies.

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supporting

confidence: 76%

mentioning

confidence: 99%

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Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111)Cu interface under temperature gradient

Zhong

Zhao

Liu

et al. 2017

Applied Physics Letters

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“…This differs from earlier published work, which considered IMC formation to be fully diffusion controlled, [18][19][20][21][22] with an analytical solution of the diffusion equation of n = 1/2. However, several studies have presented values of n that vary with temperature.…”

Section: Kinetics Model Estimationcontrasting

confidence: 54%

Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization

Luu

Duan

Aasmundtveit

et al. 2013

Journal of Elec Materi

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The objective of this study is to optimize the Cu/Sn solid-liquid interdiffusion process for wafer-level bonding applications. To optimize the temperature profile of the bonding process, the formation of intermetallic compounds (IMCs) which takes place during the bonding process needs to be well understood and characterized. In this study, a simulation model for the development of IMCs and the unreacted remaining Sn thickness as a function of the bonding temperature profile was developed. With this accurate simulation model, we are able to predict the parameters which are critical for bonding process optimization. The initial characterization focuses on a kinetics model of the Cu 3 Sn thickness growth and the amount of Sn thickness that reacts with Cu to form IMCs. As-plated Cu/Sn samples were annealed using different temperatures (150°C to 300°C) and durations (0 min to 320 min). The kinetics model is then extracted from the measured thickness of IMCs of the annealed samples.

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“…In recent years, environmental concerns, legislation, and even customer preferences are propelling the microelectronics industry towards implementation of lead-free solder alloys [3,4]. Among all Pb-free solder alloys, the Sn-Cu solder system, which shows good mechanical properties (ductility, creep resistance and thermal resistance), electrical properties and low cost, is proven to be one of the most promising Pb-free candidates for electronic assembly, compared with other Sn-based solder systems [5][6][7].…”

Section: Introductionmentioning

confidence: 99%

In situ study on growth behavior of Cu6Sn5 during solidification with an applied DC in RE-doped Sn–Cu solder alloys

Zhou

Kang

Cao

et al. 2014

J Mater Sci: Mater Electron

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The growth behavior of Cu 6 Sn 5 intermetallic compounds in rare earth (RE)-doped Sn-Cu solder alloys with an applied direct current (DC) has been in situ investigated using synchrotron radiation imaging technology. The morphological evolutions of Cu 6 Sn 5 with various shapes of I-like, Y-like and bird-like are directly observed. After doping RE, the number of I-like and bird-like Cu 6 Sn 5 is decreased, but the number of Y-like Cu 6 Sn 5 is increased. The morphologies of Cu 6 Sn 5 are more uniform and the mean lengths of Cu 6 Sn 5 of different shapes are reduced in RE-doped alloys compared with that in RE-free alloys, which is attributed to the adsorption effect of RE. The growth orientation of Y-like Cu 6 Sn 5 is changed after La is doped. Additionally, with an applied DC, the nucleation rate of Cu 6 Sn 5 is increased and the growth rate is markedly enhanced resulting in the refinement of Cu 6 Sn 5 . Furthermore, the mechanisms of refinement caused by RE and DC are specifically discussed.

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Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals

Cited by 185 publications

References 22 publications

Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111)Cu interface under temperature gradient

Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111)Cu interface under temperature gradient

Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization

In situ study on growth behavior of Cu6Sn5 during solidification with an applied DC in RE-doped Sn–Cu solder alloys

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