Copper(I)
thiocyanate (CuSCN) is a stable, wide bandgap (>3.5 eV),
low-cost p-type semiconductor widely used in a variety of optoelectronic
applications, including thin film transistors, organic light-emitting
diodes, and photovoltaic cells. For CuSCN to have impact in the commercial
fabrication of such devices, large-area, low-cost deposition techniques
are required. Here, we report a novel technique for deposition of
CuSCN that addresses these challenges. Aerosol-assisted chemical vapor
deposition (AACVD) is used to deposit highly crystalline CuSCN films
at low temperature. AACVD is a commercially viable technique due to
its low cost and inherent scalability. In this study, the deposition
temperature, CuSCN concentration and carrier gas flow rate were studied
and optimized, resulting in homogeneous films grown over areas approaching
30 cm2. At the optimized values, i.e., 60 °C using
a 35 mg/mL solution and a carrier gas flow rate of 0.5 dm3/min, the film growth rate is around 100 nm/min. We present a thorough
analysis of the film growth parameters and the subsequent morphology,
composition, and structural and optical properties of the deposited
thin films.