We report on the fabrication of a
low-cut-in voltage
(a-SiC:H/Si)
heterojunction diode using femtosecond laser ablation of silicon wafers
in an octane environment. The femtosecond laser-induced plasma simultaneously
reduces, carburizes, and hydrogenates the p-type silicon to develop
a layer of hydrogenated silicon carbide (a-SiC:H) on top of the p-Si
substrate. No reactive gases, source targets, dopants, or diffusion
furnaces are required. The obtained current–voltage characteristics
of the a-SiC:H/Si diode exhibit a cut-in voltage of 0.16 V, which
is significantly lower than the rise potential of a typical SiC Schottky
diode (0.75–1.6 eV) or the barrier potential (0.9–1
eV) of a typical p-Si/n-SiC diode. Moreover, this value is far less
than the standard cut-in voltage of Si (0.7 V), or the typical body
diode SiC MOSFETs (∼3 V). The achieved low cut-in voltage and
the modest rectification ratio of the femtosecond laser-fabricated
heterojunction diode demonstrate the promising potential of a rapid,
facile, and cost-effective method for manufacturing efficient electronic
devices.