“…3 Its variability is generally explained by the dependence of the permittivity on the crystalline phase, deposition method and process parameters of the TiO 2 . Various techniques such as thermal 4 or anodic oxidation, 5 electron beam evaporation, 6 chemical vapor deposition (CVD), 7 plasma-enhanced chemical vapor deposition, 8 sol-gel methods, 9 reactive sputtering methods, 10,11 and atomic layer deposition (ALD) [12][13][14] have been reported for TiO 2 thin film fabrication. Among them, ALD seems highly suitable for obtaining conformal films with uniform thickness even at low temperatures, 15,16 allowing the manufacturing of insulator films with desired and reproducible properties.…”