1980
DOI: 10.1109/t-ed.1980.20257
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MOS interface-state density measurements using transient capacitance spectroscopy

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Cited by 35 publications
(9 citation statements)
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“…[5][6][7] For the present study, however, this method does not estimate the density of states correctly, because the defect states caused by oxygen precipitation have a continuous depth distribution, whereas the Si/SiO 2 states in MOS and MIS structures are localized at the interface. Holzlein, Pensl, and Schulz 8 extended the procedure to take account of bulk states with concentrations having a continuous distribution in depth.…”
Section: Resultsmentioning
confidence: 99%
“…[5][6][7] For the present study, however, this method does not estimate the density of states correctly, because the defect states caused by oxygen precipitation have a continuous depth distribution, whereas the Si/SiO 2 states in MOS and MIS structures are localized at the interface. Holzlein, Pensl, and Schulz 8 extended the procedure to take account of bulk states with concentrations having a continuous distribution in depth.…”
Section: Resultsmentioning
confidence: 99%
“…The measurement technique is described in detail elsewhere (14,15,17,18). The measurement technique is described in detail elsewhere (14,15,17,18).…”
Section: Methodsmentioning
confidence: 99%
“…When relatively large FETs are available, the standard capacitance DLTS technique cm be easily modified by reverse biasing of source and drain regions, and measuring the gate-substrate MOS structure [247]. Furthemore, unlike the simple MOS structure, the existence of the source and drain in a MOSFET, being large reservoirs of minon ty current caniers, allows measurements of minority carrier traps [245,246] although the data interpretation can be complicated by simultaneous trapping and emission of majonty carriers To avoid the above mculties, the conductance DLTS [32] was proposed for measurements of MOSFETs.…”
Section: Overview Of Ter3 Dlts Techniques Applied For Fetsmentioning
confidence: 99%