2020 IEEE International Electron Devices Meeting (IEDM) 2020
DOI: 10.1109/iedm13553.2020.9372112
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MRAM in Microcontroller and Microprocessor Product Applications

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Cited by 7 publications
(2 citation statements)
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“…The NVM elements and SRAM part are integrated in an nvSRAM bitcell by a bit-to-bit connection instead of a macro-to-macro connection [19,64]. By storing commonly used routines in the nvSRAM, the startup latency and associated energy consumption from data movement can be eliminated, enabling more efficient edge computing applications [65].…”
Section: Characteristics Of Various Storage Typesmentioning
confidence: 99%
“…The NVM elements and SRAM part are integrated in an nvSRAM bitcell by a bit-to-bit connection instead of a macro-to-macro connection [19,64]. By storing commonly used routines in the nvSRAM, the startup latency and associated energy consumption from data movement can be eliminated, enabling more efficient edge computing applications [65].…”
Section: Characteristics Of Various Storage Typesmentioning
confidence: 99%
“…The above disadvantages have emerged as unavoidable bottlenecks limiting their further development. [30,31] As a new type of two-terminal neuromorphic device, FTJ based on ferroelectric material has lower power consumption compared with the traditional RRAM and MRAM devices, and the smaller nonlinearity and multilevel conductivity state of FTJ can enhance the accuracy of signal conditioning. [32] Meanwhile, the behavior of tunnel resistance (TER) changing with external voltage alterations closely resembles synaptic plasticity, which can emulate the signal transduction process of the real synapse.…”
Section: Introductionmentioning
confidence: 99%