2009
DOI: 10.5104/jiepeng.2.5
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Multi-Chip Module Fabricated by W-CSP Method using Excimer Laser Via-Hole Formation and Cu Plating

Abstract: Recently high-density packaging technologies have been in strong demand in an effort to realize the ubiquitous networking society. A wafer-level chip size packaging (W-CSP) technology is one of the most promising technologies for high density and environmentally-friendly packaging. The purpose of this study is to propose a fabrication method for a multichip module system using W-CSP technology. In this study, we fabricated a two-chip module with W-CSP using an excimer laser to form via-holes and electro-platin… Show more

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