2016 IEEE International Conference on Image Processing (ICIP) 2016
DOI: 10.1109/icip.2016.7532458
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Multi-feature sparse-based defect detection and classification in semiconductor units

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Cited by 4 publications
(2 citation statements)
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“…Predictive techniques, using algorithms as regression or decision trees, are often used in semiconductor literature to estimate wafer quality [81], fault detection [121,136], or cycletime [170]. Classification techniques in quality control arise as a way to classify defects [83], failures in bin maps [91], or production lots [131]. The exploration of yield loss causes [84] or failure diagnostics [98] is performed using techniques as rule induction, decision trees, and association rules.…”
Section: Discussionmentioning
confidence: 99%
“…Predictive techniques, using algorithms as regression or decision trees, are often used in semiconductor literature to estimate wafer quality [81], fault detection [121,136], or cycletime [170]. Classification techniques in quality control arise as a way to classify defects [83], failures in bin maps [91], or production lots [131]. The exploration of yield loss causes [84] or failure diagnostics [98] is performed using techniques as rule induction, decision trees, and association rules.…”
Section: Discussionmentioning
confidence: 99%
“…In the semiconductor literature, predictive approaches for estimating wafer standard [56], defect identification [57,58], or process time [59]. In quality control, classification algorithms are used to categorize defects [60], failures of bin maps [61], or lots. Techniques are used to investigate the causes of yield loss or failure diagnostics [5].…”
Section: Reviewsmentioning
confidence: 99%