“…In recent times, resistive random-access memory (RRAM) devices have attracted significant attention over the conventional complementary metal oxide semiconductor (CMOS)-based non-volatile memory (NVM) devices. − Currently, several research groups have been continuously working on modeling, simulation, fabrication, and engineering of RRAM devices to improve their performance and in exploring their suitability for applications in various fields. − There are numerous reports on the resistive switching (RS) behavior of the devices based on binary transition metal oxides (TMOs) such as HfO 2 , − ZrO 2 , − TiO 2 (stoichiometric films), Cu x O, , TaO x , WO x , and HfO x (sub-stoichiometric films). , HfO 2 and HfO x have received special attention in view of their compatibility with the state-of-the-art Si-based integrated circuit (IC) technology. − In previous studies, it was reported that the set and reset voltages are high for the stoichiometric HfO 2 -based RRAM devices . A few reports suggest that the sub-stoichiometric (HfO x ) films may play a critical role in lowering the set and reset voltages , for realizing low-power and energy-efficient devices. − …”