Multi-Material Heatsink Design Using Level-Set Topology Optimization

Abstract

In this article we apply a Level-set topological optimization algorithm to the design of multi-material heat sinks suitable for electronics thermal management. This approach is intended to exploit the potential of metal powder additive manufacturing technologies which enable fabrication of complex designs. The article details the state-of-the-art in topological optimization before defining a numerical framework for optimization of two-material and three-material based heatsink designs. The modelling framework is then applied to design a pure copper and a copper-aluminum heatsink for a simplified electronics cooling scenario and the performance of these designs are compared. The benefits and drawbacks of the implemented approach are discussed along with enhancements that could be integrated within the framework. A benchmarking study is also detailed which compares the performance of topologically optimized heat sink against a conventional pin-fin heat sink. This is the first time that topological optimization methods have been assessed for multi-material heat sink design where both conduction and convection are included in the analysis. Hence, the reported work is novel in its application of a state-of-the-art Levelset topology optimization algorithm to design multi-material structures subject to forced convective cooling. This paper is intended to demonstrate the applicability of topological optimization to the design of multi-material heatsinks fabricated using additive manufacturing processes and succeeds in this objective. The paper also discusses challenges, which need to be addressed in order to progress this modelling as a design approach for practical engineering situations. The presented methodology is able to design thermal management structures from a combination of aluminum and copper that perform similarly to pure copper but utilizing less expensive materials resulting in a cost benefit for electronics manufacturers.

A novel multi-material topology optimization method for permanent magnet assisted synchronous reluctance motors

“…Although one gene value of each design element is optimized in the single-material topology optimization, the design variables of multi-material topology optimization are twice the number of the single-material topology optimization (Sato et al , 2015; Jung and Min, 2019; Santhanakrishnan et al , 2019; Guo and Brown, 2019; Shah et al , 2021). Consequently, the solution space becomes more complex than that of single-material topology optimization.…”

“…In the present study, a novel multi-material topology optimization method is proposed to improve the performance of PM-SyRMs. In the conventional method, the distributions of the magnet, core and air materials are varied simultaneously (Sato et al , 2015; Jung and Min, 2019; Santhanakrishnan et al , 2019; Guo and Brown, 2019; Shah et al , 2021). Because design parameters, by which the material distribution of magnets, cores and air is expressed, are more than that of the single-material topology optimization, the solution space becomes more complex and it is difficult to obtain optimal solutions with better performance using the conventional multi-material topology optimization method.…”

Multimaterial Topology Optimization Method Based on Global Search by Combinatorial Optimization and Local Search by Variable Design Region Method

“…Through this structure, both the magnet and reluctance torque can be utilized effectively; thus, high torque can be obtained with a small magnet. To apply the topology optimization method to hybrid-type motors, multi-material topology optimization is required [21][22][23][24]. In [21], the magnet, flux barrier, and core shape of a PM motor were represented by multiple shape functions.…”

Evaluation of Active Heat Sinks Design under Forced Convection—Effect of Geometric and Boundary Parameters

“…Later, Syed-Khaja et al [ 14 ] used PBF to fabricate a heat sink design that showed key enabling advantages such as the reduction in volume, weight, and chip temperatures. To date, several other studies have emerged regarding heat sinks produced by additive manufacturing [ 5 , 15 , 16 , 17 , 18 , 19 , 20 ].…”